Digits2Widgets (D2W)

Digits2Widgets (D2W)

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Digits2Widgets are more than a 3D printing bureau. With current inflated expectations of 3D printing, they encourage clients to consult with them prior to printing anything, in order to ensure that the best possible result is achieved first time.
 
All of the staff are 3D printing experts, but also come from a broad range of design backgrounds, so they can understand your objectives and advise on the most appropriate technologies, materials and any design modifications that will best suit your project. Their aim is to help clients make digital design and 3D printing technologies most purposeful, today.
 
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2024
18 Apr 2024

Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC & AI Products

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.
14 Mar 2024

CEA-Leti (Advanced Semiconductor Packaging)

CEA-Leti is a renowned research organization based in France, specializing in applied research in microelectronics and nanotechnology. Recently, IDTechEx conducted an interview with Emilie Bourjot, a Project Manager within CEA-Leti's 3D hybrid bonding technologies research group, to gain insights into their ongoing research in this field. This interview aimed to explore CEA-Leti's advancements and contributions to the development of 3D hybrid bonding technologies.
2023
8 Dec 2023

Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications

IDTechEx Report: Dr Yu-Han Chang and Dr James Jeffs
4 Dec 2023

EVG (3D Hybrid Bonding Tool)

EV Group (EVG) supplies equipment and process solutions for manufacturing semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Its product range includes wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL), and metrology equipment. It also offers tools like photoresist coaters, cleaners, and inspection systems. IDTechEx had a discussion on advanced semiconductor packaging with EVG during Semicon Europe in November 2023.
1 Dec 2023

NanoWired

NanoWired offers Cu NanoWire technologies as an alternative solution to solder, silver-sintering bondwire-technology as well as laser-welding across a range of applications in the semiconductor packaging sector. Yu-Han Chang, Senior Technology Analyst at IDTechEx, conducted an interview with Olav Birlem, who serves as the CEO of NanoWired GmbH, to gain insights into the company and its technology offerings.
15 Sep 2023

Advancing Cu-Cu Hybrid Bonding: The Future of Semiconductor Packaging

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional flip-chip soldering. One prominent advancement in this field is the 3D Cu-Cu Hybrid Bonding technology, which offers a transformative solution. IDTechEx have been closely monitoring the advancements in 2.5D and 3D advanced semiconductor packaging.
28 Jun 2023

Materials and Processing for Advanced Semiconductor Packaging 2024-2034

IDTechEx Report: Dr Yu-Han Chang and Sona Dadhania
2018
17 Apr 2018

3D Printing Awards Presented at the IDTechEx Show! Berlin

At last week's IDTechEx Show! in Berlin, Additive Industries were presented with the 'Best Development in 3D Printing' Award.
12 Apr 2018

A 3D Printed Book For Albert Einstein

Digits2Widgets (D2W), United Kingdom
2017
11 May 2017

Transcending 3D Printing

Digits2Widgets (D2W), United Kingdom
22 Mar 2017

Unparalleled market insights of 3D printing at the IDTechEx Show! -

IDTechEx are delighted to be back in Berlin on 10-11 May for the annual 3D Printing Europe event and offers the opportunity for key innovators and end-users across several verticals to share their insights and expertise in the leading edge of additive manufacturing
2016
28 Apr 2016

The View From A 3D Printing Bureau - How People Are Purposefully Using Nylon SLS Today

Digits2Widgets (D2W), United Kingdom