15 Sep 2023
Advancing Cu-Cu Hybrid Bonding: The Future of Semiconductor Packaging
Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional flip-chip soldering. One prominent advancement in this field is the 3D Cu-Cu Hybrid Bonding technology, which offers a transformative solution. IDTechEx have been closely monitoring the advancements in 2.5D and 3D advanced semiconductor packaging.
17 Apr 2018
3D Printing Awards Presented at the IDTechEx Show! Berlin
At last week's IDTechEx Show! in Berlin, Additive Industries were presented with the 'Best Development in 3D Printing' Award.
22 Mar 2017
Unparalleled market insights of 3D printing at the IDTechEx Show! -
IDTechEx are delighted to be back in Berlin on 10-11 May for the annual 3D Printing Europe event and offers the opportunity for key innovators and end-users across several verticals to share their insights and expertise in the leading edge of additive manufacturing