LiquidCool Solutions

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2025

Thermal Management For Data Centers 2026-2036: Technologies, Markets, and Opportunities

IDTechEx Report:

Thermal Interface Materials 2026-2036: Technologies, Markets and Forecasts

IDTechEx Report:

Thermal Management for Advanced Semiconductor Packaging 2026-2036: Technologies, Markets, and Opportunities

IDTechEx Report: Dr Yu-Han Chang

Sustainability for Data Centers 2025-2035: Green Technologies, Market Forecasts, and Players

IDTechEx Report: Eve Pope

2024

Hardware for HPC, Data Centers, and AI 2025-2035: Technologies, Markets, Forecasts

IDTechEx Report: Dr Shababa Selim and Dr Yu-Han Chang

LiquidCool Solutions — Chassis-Based Immersion Cooling

This is a full company profile on LiquidCool Solutions. IDTechEx Analyst, Yulin Wang, recently interviewed Herb Zien, Vice Chair of LiquidCool Solutions. Herb discussed LiquidCool Solutions' unique technology of chassis-based immersion cooling, as well as the unique advantages that it offers compared to direct-to-chip/cold plate cooling and traditional tank-based immersion cooling.