4 May 2021
IDTechEx interviewed Simon Chaput and Stuart Nixdorff of Boréas Technologies at the time of their launch of a new reference design for haptics in wearables. This profile describes that launch and other company updates.
19 Apr 2021
IDTechEx spoke to John Griffin and Linda Quach, VP Products & Marketing and Director of Marketing respectively at Immersion. They presented their updated corporate deck and we had a wider discussion about the state of the haptics industry and the evolving position of Immersion within it.
24 Feb 2021
TDK Corporation Joins GenCell on Novel Approach to Green Ammonia
Japanese Technology Company TDK Corporation Joins Alkaline Fuel Cell Manufacturer GenCell in Developing a Novel Low-Cost Approach to Green Ammonia - the Fuel of the Future
22 Jan 2021
StoreDot Launch of First Ever 5-Minute Charge Li-ion Battery Samples
StoreDot announces the availability of its first-generation 5-minute charge battery engineering samples. This represents a significant milestone for the company in its mission to eliminate the range and charging anxiety of electric vehicles, demonstrating the commercial viability of XFC batteries for the first time via a small form-factor battery cell.
4 Nov 2020
New DLP Resin Offers Fast Printing Speeds and Unique Flexibility
Royal DSM has announced Somos® QuickGen 500, a game-changing, fast-printing, general purpose engineered resin for digital light processing (DLP) and liquid crystal display (LCD) 3D printing.
4 Sep 2020
TDK: Sensors for EV Thermal Management
TDK is a Japanese multinational electronics company. At the recent ChargedEVs event they demonstrated their portfolio of temperature sensors for EV thermal management.
12 Jun 2020
mmWave electronics: towards AiP (antenna-in-package) technologies
Electronic packaging will play an important role in enabling higher frequency - e.g., mmWave - electronics. In particular, as the frequency goes up, the antenna spacing shrinks, the need to have large antenna arrays for gain as well as beam forming purposes increases; and the imperative to cut down transmission loss including by placing components closer together inside a package dramatically grows