Sub-6 GHz and mmWave 5G: Opportunities for Thermal Management Materials

5G enables incredible download rates with minimal latency and has the potential to enable many future technologies, such as autonomous cars, various augmented reality applications and much more. With 5G technology, however, comes an increase in the need for effective thermal management. High frequency, active antenna units utilise densely packed arrays of components all of which generate significant heat. This is a concern for the infrastructure and smartphone markets. Heat generated in 5G systems has a knock-on effect on the antenna design, choice of semiconductor technologies, die attach methods and thermal interface materials.
This webinar provides an introduction to the various aspects of 5G thermal management, based on the new IDTechEx report "Thermal Management for 5G".
The webinar, presented by IDTechEx Technology Analyst Dr James Edmondson, covers:
  • An introduction to changes in telecommunications infrastructure
  • The choice of semiconductor technology for sub-6 GHz and mmWave 5G
  • Case studies of sub-6 GHz and mmWave antenna
  • An overview of die attach materials and methodology
  • Thermal interface materials for infrastructure and smartphones
  • Power consumption for 5G