CEA-Leti (Advanced Semiconductor Packaging) CEA-Leti is a renowned research organization based in France, specializing in applied research in microelectronics and nanotechnology. Recently, IDTechEx conducted an interview with Emilie Bourjot, a Project Manager within CEA-Leti's 3D hybrid bonding technologies research group, to gain insights into their ongoing research in this field. This interview aimed to explore CEA-Leti's advancements and contributions to the development of 3D hybrid bonding technologies. CEA-Leti (Advanced Semiconductor Packaging)