Encapsulation of flexible electronics: alternatives to multilayers
17 September 2014 | Worldwide by Dr Harry Zervos
IDTechEx has been following closely the space for flexible encapsulation and current trends show case that films or in-line deposition based on multi layers (alternating layers of organic and inorganic materials, also known as dyads) is the preferred technology. Alternatives have also been in development too though, so we will briefly analyze some of the main candidates that could potentially displace multilayer approaches: flexible glass, single layer approaches and atomic layer deposition are the technologies examined in this article.
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