Flexible barrier technologies: a brief review of technology options
25 June 2015 | Worldwide by Dr Harry Zervos
Back in 2014, we witnessed the launch of the first displays deposited on flexible substrates, and the first efforts to encapsulate them. There are significant differences in the encapsulation techniques utilized by each of the companies commercializing flexible electronics. These differences signify the variety of technologies available, in terms of deposition as well as material options for the barrier films, some of which are discussed in this article
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