Thermal Management for Data Centers 2023-2033: Technologies, Markets and Opportunities
This report analyzes air cooling, cold plate/direct-to-chip cooling, immersion cooling, as well as the associated coolant distribution units (CDUs), coolant fluids, thermal interface materials (TIMs), and pumps used in data centers. It evaluates the advantages and disadvantages of each cooling method, presents a roadmap illustrating the market adoption of these technologies by data center IT capacity based on insights from industry leaders, and outlines crucial factors that companies need to consider when supplying components to the data center cooling industry.
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