Applications of copper in passenger cars, copper for electrification, copper for autonomous cars, copper for automotive wiring harness, technology trends, copper replacement, copper demand forecasts by region, application and more
Vehicle to Everything (V2X), Connected Vehicles, Software-Defined Vehicles (SDVs), Intelligent Transportation Systems (ITS-G5), DSRC, C-V2X, 5G, Autonomous Vehicles, Software as a Service (SaaS), Autonomy as a Service (AaaS), and Automotive AI.
Driver Monitoring Systems (DMS), Occupant Monitoring Systems (OMS), Interior Monitoring, Infrared Cameras, Time-of-Flight Cameras, Radars, Capacitive Sensors, Torque Sensors, ECG, EEG, Eye Movement Tracking
Adoption of radar enabled ADAS functions, new radar technologies, emergence of 4D imaging radar, imaging radar benchmarking, automotive radar market forecast, leading tier 1 and tier 2 products, radar tier 1 supplier market share.
Unit Load AGV/AMR, Tow Tractor AGV, Heavy-duty AGV, Forklift Robots, Sidewalk Robots, Drones, Delivery Vans, Autonomous Trucks, Case-Picking Robots. Technology Analysis of LiDAR, Cameras, Battery. Key market size and unit sales forecast by robot type.
Technology analyses and market forecasts for the global sale of AI chips for edge applications by geography, architecture, packaging, end-user, application, and industry vertical.
Peak car sales, commercial robotaxi service deployments, ADAS features and adoption, emergence of certified SAE level 3 vehicles, Mobility as a Service (MaaS), lidar, radar, camera, in-cabin cameras, thermal imaging, HD map, 5G and V2X, market forecasts
Semiconductor materials trends within electric and autonomous vehicles, battery management system (BMS), microcontrollers (MCU), Systems on chips (SoCs), ADAS, LiDAR, radar, 5G connectivity. Silicon (Si), Gallium Nitride (GaN), Silicon Carbide (SiC).
The complete analysis of the global RFID industry
Material demands, benchmarking, market trends, and drivers for emerging markets: EMI shielding, 5G, electric vehicles, data centers, ADAS, and consumer electronics. High performance thermal interface materials.
Market analysis of hardware enabling quantum computing. Includes twenty-year quantum computing market forecasts, with superconducting, photonic, silicon-spin, neutral-atom, trapped-ion, diamond defect, topological, and annealing categories.
6G, sub-THz, 6G technology benchmarking, Non-Terrestrial Networks (NTN), LEO, Reconfigurable Intelligent Surface (RIS), cell-free massive MIMO, THz components, low-loss materials, packaging, heterogeneous integration, player landscape
A technological and market evaluation of the sensors used in robots by sensor type and applications. Mobile robots, drones, industrial robotic arms, cobots, and service robots. Sensor types including force/torque, proximity, cameras, LiDAR, and more.
Flake-based, nanoparticle, particle-free, copper, stretchable, thermoformable nanowire inks for photovoltaics, EMI shielding, printed electronics, flexible hybrid electronics, wearable electronics, e-textiles, 3D electronics.
Data-centric approaches for design and discovery within materials science R&D. Notable advancements in data infrastructures and machine learning. Player profiles, technology progression, market outlook, business models, and case studies
5G sub-6 GHz & mmWave, regional market forecast, 5G key technology benchmarking, supply chain, player assessment, Open RAN, vendor landscape, smart electromagnetic environment, power consumption, massive MIMO, 5G AiP (antenna-in-package), advanced 5G
Covering Sanger sequencing, next-generation sequencing (NGS), SMRT sequencing and nanopore sequencing. Analysis of technologies, market landscape, and opportunities. Forecast of DNA sequencing market 2023-2033.
Collaborative robots (cobots), mobile manipulators, end-effectors, sensors, grippers, automotive manufacturing, picking and placing, palletizing, packaging, food and beverage, electronics
Key players, industry analysis, enabling technologies, and market forecasts
Powertrain (BEV, PHEV, FCEV); Regions (US, China, Norway, UK, France, Germany, Netherlands, Denmark, RoW); Autonomy (L2, L3, L4); Battery (NMC, NCA, LFP, Silicon, Solid-state); Motor (PM, WRSM, ACIM, Axial-flux, In-wheel); Power Electronics (SiC, Si IGBT)