Adhesive Applications in the Smart Label Sector (RFID Smart Labels Europe 2006)

Mr Florian Hierl, Business Development Manager
Delo Industrial Adhesives, Germany
 

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Presentation Summary

  • Principle of Flip-Chip-Attach
  • Solutions for Flip-Chip-Bonding: ACP vs. NCP
  • STRAP-Attach
  • Evolution in adhesive development for Flip-Chip-Bonding
  • State of the art adhesives: what is possible
  • Reliability investigations: T-Shock, Humidity storage

Speaker Biography

Florian Hierl joined DELO in october 2001. In april 2006 Florian took over the responsibility for the business development in the field of RFID with focus on flip-chip and strap-attach.With his expertise in this field Florians function is to extract the gained knowlegde of market and technology into the companies core strategy for future business in smart label.
 
Florian graduated in Chemical Enginnering in 1998 and worked 3,5 years in Research to apply suprcritical fluids in chemical reactions. Prior to his employment in Business Development he was responsible as Sales Manager for DELO in Germany.

Company Profile

Delo has nearly 45 years of experience in the field of industrial adhesives. DELO has been working in the smart card sector with several proven records of success: The DELO products for the flip-chip industry enable secure electrical contacting and very short production times; opaque chip encapsulation compounds protect the chip against unauthorized viewing and copying; the Dam&Fill method patented by DELO enables defined geometries as well as minimum encapsulation heights.