Flexible Silicon for the Internet of Things (Printed Electronics USA 2013)

Dr Jayna Sheats, CTO
Terepac Corp.
Canada
 
Nov 21, 2013.

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Presentation Summary

• Requirements for wearable and more generally pervasive electronics
• Advantages of silicon microelectronics
• Terepac's solution for the Internet of Things

Speaker Biography (Jayna Sheats)

Dr. Jayna Sheats is a co-founder of Terepac Corporation and has been its full-time CTO since 2008. From 2004 until 2008 she served as Vice President of Manufacturing Technology and subsequently Associate CTO at Nanosolar, Inc. Before that, she spent two years in consulting and entrepreneurial development in thin film electronics, particularly involving roll-to-roll processing techniques, and was a co-founder of two companies and advisor to several. Prior to this, she spent 20 years at HP Labs, working on a wide variety of projects in thin film electronics, including microlithography, superconductivity, and electroluminescence. She also initiated and supported a program to introduce Internet technology in the developing world. She is a fellow of the AAAS, with a PhD in physical chemistry from Stanford University, and has authored or co-authored 59 journal and book articles and more than 40 patents. She lives in Palo Alto, CA with her son and three cats.

Company Profile (Terepac)

Terepac logo
Terepac Corporation is a microelectronics design and manufacturing company which offers a unique, revolutionary and proprietary set of technologies which enable products to be small, thin, flexible and inexpensive; realizing the vision of pervasive electronics inherent in the Internet of Things. The process takes bare silicon wafers from state of the art foundries, divides them into chips which are barely visible, places and connects them on paper-thin substrates in micromodules with the physical format of a label, which can conform to curved surfaces and be almost unnoticeable while retaining unsurpass¬ed electrical characteristics, including low power and high reliability
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