Alternative Assembly Technologies & Materials Evolution To Support Hybrid Electronics Packaging (Wearable Europe 2018)

Mr Jeff Knight, General Manager-Advanced Process Lab
Universal Instruments
United States

Presentation Summary

The electronics design, packaging and assembly industries are being challenged to adapt to the needs of the fast changing market segments such as wearables, IoT, Automotive and other markets resulting in an evolution of new materials and alternative assembly processes that will enable manufacturers to bring novel devices to the market.

Company Profile (Universal Instruments Corporation)

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Universal's core products include a comprehensive surface mount platform portfolio; leading-edge advanced semiconductor packaging solutions for a fast-evolving technology landscape; a through-hole lineup that is the industry standard for productivity and reliability; flexible automation cells for odd-form or light mechanical and back-end assembly; line software to manage manufacturing activities; an advanced process lab and industry-leading consortium.
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