Mr Peter McClure, Advanced Process Laboratory
A manufacturing process for the attachment of components to temperature sensitive substrates, such as PET or TPU, will be a key enabling capability for future flexible electronic products. Conventional solder reflow oven processes (symmetric heating) cannot be used because the temperature required for soldering will damage most low cost flexible substrate materials. Instead, asymmetric heating processes (i.e., heating solder independently of the substrate) are being actively explored. One such asymmetric heating method, area Laser Selective Reflow (aLSR), is being used to bond WLCSPs to temperature sensitive flexible substrates. Preliminary findings using aLSR with a variety of low temperature substrate materials and bond pad metallizations will be discussed.
Company Profile (Universal Instruments Corporation)
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Universal's core products include a comprehensive surface mount platform portfolio; leading-edge advanced semiconductor packaging solutions for a fast-evolving technology landscape; a through-hole lineup that is the industry standard for productivity and reliability; flexible automation cells for odd-form or light mechanical and back-end assembly; line software to manage manufacturing activities; an advanced process lab and industry-leading consortium.