Flexible Hybrid Electronics Enabling Structural Health Monitoring For Transportation (Sensors USA 2018)

Mr Wilfried Bair, VP Engineering
NextFlex
United States
 

Downloads

USA 2018 (pdf) Presentation - IDTechEx*
USA 2018 (audio) Presentation - IDTechEx*

If you already have access, please [Login]
Access can be purchased via IDTechEx Credits

Presentation Summary

The speaker will introduce NextFlex, America's Flexible Hybrid Electronics Manufacturing Institute, and will describe flexible hybrid electronics (FHE) technology developments via application examples in transportation. The speaker will then elaborate on why FHE-enabled technology advancements are well suited for transportation applications in the following sectors: aircraft - airplanes, helicopters, and drones, and infrastructure - bridges, highways, railways and pipelines. Finally, the speaker will outline critical areas where new development in needed and will introduce NextFlex's broad portfolio of development projects in this area and the NextFlex process capabilities for prototyping and pilot-scale FHE manufacturing at the NextFlex Technology Hub in San Jose, Calif.

Speaker Biography (Wilfried Bair)

Wilfried Bair is responsible for device integration and system level hardware projects for NextFlex. Prior to joining NextFlex, Wilfried was VP of Business Development for Tango Systems where he developed strategic partnerships and led them to enter the two fastest growing semiconductor packaging market segments, establishing them as a market leader. Previously, as VP of Strategic Business Development for SUSS Microtec AG, Wilfried provided leadership to business units, identifying disruptive technology gaps, new marketing opportunities and acquisition targets. Other positions held at SUSS were GM, North American Operations, and Division Manager of Wafer Bonders. Wilfried's technical expertise spans leading edge packaging processes, next generation solar and energy storage, semiconductor equipment and process, and device expertise for automotive, consumer and medical applications. Wilfried holds advanced degrees in Manufacturing and Production Planning Systems, Organizational Development, and International Marketing from the University of Linz in Austria.

Company Profile (NextFlex)

NextFlex logo
NextFlex®, America's Flexible Hybrid Electronics Manufacturing Institute, is a leading force in the Manufacturing USA network. It is a consortium of companies, academic institutions, non-profits, and state, local, and federal governments with a shared goal of advancing U.S. manufacturing of FHE. Since its formation in 2015, NextFlex's elite team of thought leaders, educators, problem solvers, and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap, and promote sustainable manufacturing ecosystems.
View NextFlex Timeline