RFID for Electronic Passports (Smart Labels Europe 2004)

Mr Patrick Henzen, Business Development - Infrastructure & Services
Philips Semiconductors, Austria
 

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Summary

  • Market outlook E-passports
  • Update from Semiconductor perspective
  • The Philips offering for E-passports

Company Profile (NXP)

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With over 4.5 billion RFID-based chips sold to date, NXP Semiconductors is the world's leader in the design and manufacturing of ICs used in smart labels, tags and the corresponding reader components. The company has been in RFID since 1988; its most comprehensive IC portfolio (HITAG, ICODE, UCODE, reader IC's for LF and HF) covers all relevant RFID frequency bands and meets corresponding ISO/EPC standards. The NXP Application and System Centres in Austria and China improve the performance and reliability of existing RFID systems by thoroughly testing applications under real-life conditions for various industries.
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