New Report: Thermal Management for Advanced Semiconductor Packaging

As AI computing demands and the thermal design power (TDP) of high-performance chips continue to rise, and the industry shifts from 2.5D to 3D packaging architectures, thermal management has emerged as a key barrier to large-scale commercialization and adoption. To address this growing challenge, the industry is exploring a range of strategies, including the use of advanced thermal materials (such as liquid metal, diamond, and graphene), lidless chip designs, optimization of the power delivery network, implementation of backside power delivery, and the adoption of liquid and microfluidic cooling technologies.

 

The new IDTechEx report, "Thermal Management for Advanced Semiconductor Packaging 2026-2036: Technologies, Markets, and Opportunities", provides a comprehensive analysis of the transition from 2.5D to 3D advanced semiconductor packaging (ASP), advancements in power delivery methods (e.g., backside power and through-silicon vias), thermal challenges associated with 3D integrated circuit packaging, the use of innovative thermal materials (such as thermal interface materials and diamond substrates), and the implementation of liquid cooling techniques, including direct-to-chip, immersion, and microfluidic cooling systems.

 

 

This report provides critical market intelligence on the power and thermal management challenges of advanced semiconductor packaging (2.5D and 3D), novel thermal materials, and the trend of liquid cooling solutions.

 

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For the full report details and sample pages reach out to our team at research@IDTechEx.com, or visit www.IDTechEx.com/TMASP.