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1. | EXECUTIVE SUMMARY |
1.1. | Additive electronics and the transition to three dimensions |
1.2. | Motivation, applications and challenges for 3D/additive electronics |
1.3. | Long-term vision for 3D electronics |
1.4. | Metallization and materials for each 3D electronics manufacturing methodology |
1.5. | SWOT analysis: Alternative approaches to 3D/additive electronics |
1.6. | Applying electronics to 3D surfaces (MID) |
1.7. | Comparing LIFT with other deposition methods |
1.8. | Comparison of metallization methods (aerosol, inkjet, extruded conductive paste, laser direct structuring, print-then-plate, two-shot molding, laser induced forward transfer) |
1.9. | Status and market potential of metallization methods for each application |
1.10. | Comparing different conductive inks materials |
1.11. | Challenges of comparing conductive inks |
1.12. | An introduction to in-mold electronics (IME) |
1.13. | Progression towards 3D electronics with IME |
1.14. | Commercial advantages of IME |
1.15. | Fully 3D printed electronics |
1.16. | 3D printed electronics combines existing manufacturing technologies |
1.17. | Advantages of fully additively manufactured 3D electronics |
1.18. | 3D printed electronics and economies of scale |
1.19. | Readiness level of 3D/additive electronics technologies for different application sectors |
1.20. | Porter's analysis of materials for 3D/additive electronics |
1.21. | Porters' analysis of manufacturing methods for 3D/additive electronics |
1.22. | Comparison of Porter's 5-forces analysis for the three 3D/additive electronics methodologies |
1.23. | Adoption roadmap for 3D/additive electronics |
1.24. | Main conclusions: Partially additive electronics (applying to 3D surfaces) |
1.25. | Main conclusions: Fully-additive 3D printed electronics |
2. | MARKET FORECASTS |
2.1. | Market forecast methodology |
2.2. | 10-year forecast for IME component area by application |
2.3. | Future (2032) IME market breakdown by application |
2.4. | Overall 10-year forecast for electronics on 3D surfaces/IME by metallization method |
2.5. | 10-year forecast for extruded conductive paste / inkjet on 3D surfaces by application |
2.6. | 10-year forecast for aerosol jet printing on 3D surfaces by application |
2.7. | 10-year forecast for laser direct structuring (LDS) on 3D surfaces by application |
2.8. | 10-year forecast by area for laser induced forward transfer (LIFT) on 3D surfaces by application |
2.9. | 10-year forecast for fully 3D printed electronics via fused deposition modelling (FDM) by application |
2.10. | 10-year forecast for fully 3D printed electronics via stereolithography (SLA) by application |
2.11. | 10-year forecast for fully 3D printed electronics via stereolithography (SLA) by application |
2.12. | 10-year revenue forecast data table for IME and electronics on 3D surfaces (USD millions) |
2.13. | 10-year revenue forecast data table for fully additive 3D electronics (USD millions) |
2.14. | 10-year forecast data table by revenue for all types of 3D/additive electronics (USD millions) |
2.15. | 10-year area forecast data table for IME and electronics on 3D surfaces (m2) |
2.16. | 10-year volume forecast data table for fully additive 3D electronics (m3) |
2.17. | 10-year forecast data table by volume for all types of 3D/additive electronics (m2) |
3. | INTRODUCTION TO 3D/ADDITIVE ELECTRONICS |
3.1. | Overview of the electronic circuits market |
3.2. | Visualizing the partially and fully additive routes to 3D electronics |
3.3. | Growing academic interest in 3D/additive electronics |
3.4. | Patent trends in 3D/additive electronics |
3.5. | Patent trends in in-mold electronics |
3.6. | 3D heterogeneous integration as a long-term aim |
3.7. | Manufacturing method flowchart for 3D/additive electronics |
3.8. | Comparing the production speed of approaches to 3D electronics |
3.9. | 3D electronics requires special electronic design software |
3.10. | Readiness level of 3D electronics technologies and applications |
3.11. | 3D electronics builds on 2D printed/flexible electronics |
3.12. | 2D printed/flexible electronics: Commercial successes and failures |
3.13. | Distinguishing manufacturing methods for 3D electronics |
3.14. | Examples of companies interested in applying 3D electronics |
4. | CONVENTIONAL 2D PCBS AND FPCBS |
4.1. | Traditional PCBs: History |
4.2. | Traditional PCBs: Mounting components |
4.3. | Traditional PCBs: Layers |
4.4. | Traditional PCBs: Layers |
4.5. | Traditional PCBs: Complexity |
4.6. | Traditional PCBs: Geography |
4.7. | Traditional PCBs: Prototyping |
4.8. | Traditional PCBs: Mechanics |
4.9. | Traditional PCBs: Heat |
4.10. | SWOT analysis: Traditional PCBs |
5. | ELECTRONICS ONTO 3D SURFACES (INCLUDING 3D MID) |
5.1.1. | Electronics on 3D surfaces / molded interconnect devices (MIDs) |
5.1.2. | 3D electronics on surfaces on surfaces enables simplification |
5.2. | Electronics onto 3D surfaces: Metallization methods |
5.2.1. | Applying electronics to 3D surfaces (MID) |
5.2.2. | Comparing selective metallization methods |
5.2.3. | Comparison of metallization methods (aerosol, inkjet, extruded conductive paste, laser direct structuring, print-then-plate, two-shot molding, laser induced forward transfer, electrohydrodynamic printing) |
5.3. | Laser direct structuring |
5.3.1. | Laser direct structuring (LDS) |
5.3.2. | Laser activation and electroless plating for LDS |
5.3.3. | Laser direct structuring has many applications |
5.3.4. | Capabilities of laser direct structuring |
5.3.5. | Fine pitch capability of LDS |
5.3.6. | Combining 3D printing with LDS for prototyping? |
5.3.7. | Expanding LDS MID to non-plastic substrates? |
5.3.8. | Light-based synthesis of metallic nanoparticles - an additive free development of LDS |
5.3.9. | LPKF: The original developers and licence holders of LPKF |
5.3.10. | LDS manufacturers authorised by LPKF |
5.3.11. | Laser direct structuring: SWOT |
5.3.12. | Laser direct structuring: Company details and profiles |
5.4. | Aerosol printing |
5.4.1. | Aerosol printing |
5.4.2. | Aerosol deposition onto 3D surfaces |
5.4.3. | Aerosol deposition vs LDS (laser direct structuring) |
5.4.4. | Varying line width to control resistance with aerosol printing |
5.4.5. | Example of aerosol printed functionality |
5.4.6. | Aerosol printing in academia / R&D |
5.4.7. | Academic research: Aerosol printed transistors |
5.4.8. | Academic research: Aerosol printing for the fabrication of terahertz metamaterials |
5.4.9. | Aerosol jet printing: SWOT |
5.4.10. | Aerosol printing: Company details and profiles |
5.5. | Extruded conductive paste and inkjet printing |
5.5.1. | Electronics on 3D surfaces with extruded conductive paste and inkjet printing |
5.5.2. | Extruding conductive paste for structurally-integrated antennas |
5.5.3. | Details of extruded paste printing. |
5.5.4. | Extruded conductive paste for antennas |
5.5.5. | High resolution printing of micrometer-size conductive structures |
5.5.6. | Combining printed electronics with wire spooling |
5.5.7. | Printing electronics onto 3D surfaces enables multiple substrate materials |
5.5.8. | Ceradrop combines inkjet and aerosol for printing electronics on 3D surfaces |
5.5.9. | EU-funded AMPERE project to increase scalability of partially additive 3D electronics |
5.5.10. | SWOT: Extruded paste |
5.5.11. | SWOT analysis: Inkjet printing electronics |
5.5.12. | Extruded paste and inkjet printing: Company details and profiles |
5.6. | Laser induced forward transfer |
5.6.1. | Operating mechanism of laser induced forward transfer (LIFT) |
5.6.2. | Comparing LIFT with other deposition methods |
5.6.3. | Applications for LIFT |
5.6.4. | Altana introduces laser induced forward transfer (LIFT) for printed/additive electronics (I) |
5.6.5. | Altana introduces laser induced forward transfer (LIFT) for printed/additive electronics (II) |
5.6.6. | IO-Tech launches its first laser induced forward transfer machine |
5.6.7. | Keiron printing technologies |
5.6.8. | SWOT analysis: Laser induced forward transfer |
5.6.9. | LIFT: Company details and profiles |
5.7. | Print-then-plate |
5.7.1. | Print-then-plate: Overview (Elephantech) |
5.7.2. | Print-then-plate: Advantages |
5.7.3. | Print-then-plate: Company details and profiles |
5.8. | Electronics onto 3D surfaces: Materials |
5.8.1. | Comparing different conductive inks materials |
5.8.2. | Challenges of comparing conductive inks |
5.8.3. | Comparing conductive inks: Conductivity vs sheet resistance. |
5.8.4. | Material considerations for LDS (I) |
5.8.5. | 3D printable resin with LDS additive |
5.8.6. | Ink requirements for aerosol printing |
5.8.7. | Conductive adhesives: General requirements and challenges |
5.8.8. | Comparing conductive adhesive types |
5.8.9. | Attaching components to low temperature substrates |
5.8.10. | Laser activated copper paste for 3D electronics |
5.9. | Electronics on 3D surfaces: Applications |
5.9.1. | Applications of electronics on 3D surfaces |
5.10. | Electronic interconnects (MID) |
5.10.1. | LDS MID application examples: Automotive HMI |
5.10.2. | LDS MID in LED implementation |
5.10.3. | Raytheon: Additively manufactured electronics reduce size, weight, power and cost (SWAP-C) |
5.10.4. | Automotive applications of electronics printed onto 3D surfaces |
5.10.5. | Custom-made sensor housings for industrial IoT |
5.10.6. | Replacing wiring harnesses in automotive and aeronautical applications |
5.10.7. | Printing on 3D surfaces for biosensing |
5.11. | Antennas |
5.11.1. | LDS MID application examples: Antenna |
5.11.2. | Aerosol deposition of mobile phone antennas |
5.11.3. | Tuneable meta-materials for antennas with 3D electronics |
5.12. | Semiconductor packaging |
5.12.1. | LDS for IC packaging through-hole vias |
5.12.2. | Advanced electronics packaging with aerosol printing |
5.12.3. | Optomec gains orders for semiconductor manufacturing |
5.13. | Electronics onto 3D surfaces: Summary |
5.13.1. | Summary: Electronics onto 3D surfaces |
5.13.2. | SWOT Analysis |
6. | IN-MOLD ELECTRONICS (IME) |
6.1.1. | Introduction to in-mold electronics (IME) |
6.1.2. | Progression towards 3D electronics with IME |
6.1.3. | Commercial advantages of IME |
6.1.4. | Challenges for IME |
6.1.5. | IME value chain - a development of in-mold decorating (IMD) |
6.1.6. | IME surfaces and capabilities |
6.1.7. | IME facilitates versioning and localization |
6.1.8. | IME value chain overview |
6.1.9. | The long road to IME commercialization |
6.1.10. | IME forecast pushed back due to COVID-19 |
6.1.11. | Forecast progression in IME complexity |
6.1.12. | Overview of functionality within IME components |
6.1.13. | IME and sustainability |
6.1.14. | IME reduces plastic consumption |
6.1.15. | IME vs reference component kg CO2 equivalent (single IME panel): Cradle to gate |
6.1.16. | IME: Company details and profiles |
6.2. | In-mold electronics: Manufacturing methods |
6.2.1. | IME manufacturing process flow (I) |
6.2.2. | IME manufacturing process flow (II) |
6.2.3. | IME manufacturing process flow (III) |
6.2.4. | Manufacturing methods: Conventional electronics vs. IME |
6.2.5. | Alternative IME component architectures |
6.2.6. | Equipment required for IME production |
6.2.7. | Hybrid approach provides an intermediate route to market |
6.2.8. | Forecast progression in IME complexity |
6.2.9. | Surface mount device (SMD) attachment: Before or after forming |
6.2.10. | Component attachment cross-sections |
6.2.11. | One-film vs two-film approach |
6.2.12. | Multilayer IME circuits require cross-overs |
6.2.13. | IC package requirements for IME |
6.2.14. | IME requires special electronic design software |
6.2.15. | Faurecia concept: traditional vs. IME design |
6.2.16. | Conventional vs. IME comparison (Faurecia) |
6.2.17. | IME: value transfer from PCB board to ink |
6.2.18. | Print-then-plate for in-mold electronics |
6.2.19. | Automating IME manufacturing |
6.2.20. | Overview of IME manufacturing requirements |
6.2.21. | Integrating IME into existing systems |
6.2.22. | Current status of main IME technology developer (TactoTek) |
6.2.23. | Print-then-plate for in-mold electronics |
6.2.24. | IME requirements |
6.2.25. | Observations on the IME design process |
6.3. | In-mold electronics: Materials |
6.3.1. | IME requires a wide range of specialist materials |
6.3.2. | Materials for IME: A portfolio approach |
6.3.3. | All materials in the stack must be compatible: Conductivity perspective |
6.3.4. | Material composition of IME vs conventional HMI components |
6.3.5. | All materials in the stack must be compatible: forming perspective |
6.3.6. | New ink requirements: Surviving heat stress |
6.3.7. | Stability and durability are crucial |
6.3.8. | Stretchable vs thermoformable conductive inks |
6.3.9. | In-mold electronics requires thermoformable conductive inks (I) |
6.3.10. | Bridging the conductivity gap between printed electronics and IME inks |
6.3.11. | Gradual improvement over time in thermoformability. |
6.3.12. | Thermoformable conductive inks from different resins |
6.3.13. | The role of particle size in thermoformable inks |
6.3.14. | Selecting right fillers and binders to improve stretchability (Elantas) |
6.3.15. | The role of resin in stretchable inks |
6.3.16. | New ink requirements: Stability |
6.3.17. | Particle-free thermoformable inks (I) (E2IP/National Research Council of Canada) |
6.3.18. | Particle-free thermoformable inks (II) (E2IP/National Research Council of Canada) |
6.3.19. | Polythiophene-based conductive films for flexible devices (Heraeus) |
6.3.20. | In-mold conductive inks on the market |
6.3.21. | Dielectric inks for IME |
6.3.22. | Electrically conductive adhesives: General requirements and challenges for IME |
6.3.23. | Electrically conductive adhesives: Surviving the IME process |
6.3.24. | Specialist formable conductive adhesives required |
6.3.25. | In-mold conductive ink examples |
6.3.26. | Suppliers of thermoformable conductive inks for IME multiply |
6.3.27. | Prototype examples of carbon nanotube in-mold transparent conductive films |
6.3.28. | In-mold and stretchable metal mesh transparent conductive films |
6.4. | In-mold electronics: Applications |
6.4.1. | IME interfaces break the cost/value compromise |
6.5. | Automotive |
6.5.1. | Motivation for IME in automotive applications |
6.5.2. | Opportunities for IME in automotive HMI |
6.5.3. | Early case study of automotive IME: Ford/T-ink |
6.5.4. | IME for automotive seat controls |
6.5.5. | Direct heating of headlamp plastic covers |
6.5.6. | Steering wheel controls with HMI: Canatu/TactoTek |
6.5.7. | Quotes on the outlook for IME in automotive applications |
6.5.8. | Alternative to automotive IME: Integrated capacitive sensing |
6.6. | White goods |
6.6.1. | Opportunities for IME in white goods |
6.6.2. | Example prototypes of IME for white goods (I) |
6.6.3. | Example prototypes of IME for white goods (II) |
6.7. | Other applications |
6.7.1. | Other IME applications: Medical and industrial HMI |
6.7.2. | Home automation creates opportunities for IME |
6.7.3. | IME for home automation becomes commercial |
6.7.4. | Consumer electronics prototypes to products |
6.7.5. | IME for wearable electronics |
6.8. | In-mold electronics: Summary |
6.8.1. | SWOT: In-mold electronics (IME) |
6.8.2. | Summary: In-mold electronics (I) |
6.8.3. | Summary: In-mold electronics(II) |
7. | 3D PRINTED ELECTRONICS |
7.1.1. | 3D printed electronics extends 3D printing |
7.1.2. | Fully 3D printed electronics |
7.1.3. | 3D printed electronics combines existing manufacturing technologies |
7.1.4. | Advantages of fully additively manufactured 3D electronics |
7.1.5. | Additively manufactured electronics promises fewer manufacturing steps |
7.1.6. | Comparing 3D printed electronics with other applications |
7.1.7. | Approaches to 3D printed structural electronics |
7.1.8. | Comparing additively manufactured and conventional circuits |
7.1.9. | Examples of fully 3D printed circuits |
7.1.10. | Nano Dimension: Example additively manufactured circuits |
7.1.11. | Circuit boards of any shape: nScrypt |
7.1.12. | From 3D printed electronics to 3D printed shoes: Voxel8 |
7.1.13. | Industry departures: 'Functionalize' (USA) developed conductive thermoplastic |
7.1.14. | Paste extrusion, dispensing or printing during 3D printing |
7.1.15. | 3D printed with embedded metallization |
7.1.16. | Roadmap for 3D printed electronics |
7.1.17. | Holst Center: 3D electronics status timeline |
7.1.18. | Lessons learned from 3D printing and printed electronics |
7.2. | 3D printed electronics: Technologies |
7.2.1. | Technologies for fully additive 3D electronics |
7.2.2. | Comparing performance parameters of metallization and dielectric deposition methods |
7.2.3. | Increasing processing speed with parallelization (multiple nozzles) |
7.2.4. | HP adapts multi-jet fusion 3D printing for 3D electronics. |
7.2.5. | Electrically conductive polymers for additive manufacturing |
7.2.6. | 4D printed electronics enable structural variation with time (I) |
7.2.7. | 4D printed electronics enable structural variation with time (II) |
7.2.8. | Multifunctional composites with electronics |
7.2.9. | Nano Dimension: An introduction |
7.2.10. | Nano Dimension develop additively manufactured circuits (I) |
7.2.11. | Capabilities of Nano Dimension's dragonfly system (I) |
7.2.12. | Capabilities of Nano Dimension's dragonfly system (II) |
7.2.13. | Financial overview of Nano Dimension |
7.2.14. | Nano Dimension raises capital and makes acquisitions |
7.3. | 3D printed electronics: Materials |
7.3.1. | Functional materials |
7.3.2. | Ink requirements for 3D printed electronics |
7.3.3. | Metals |
7.3.4. | Extrude conductive filament |
7.3.5. | Conductive thermoplastic filaments |
7.3.6. | Conductive pastes |
7.3.7. | Materials for low-loss dielectrics |
7.4. | 3D printed electronics: Applications |
7.4.1. | Applications for fully additive 3D printed electronics |
7.4.2. | Profactor: Sensor packaging via additive manufacturing |
7.4.3. | Customized medical devices |
7.4.4. | Compact medical / wearable sensing |
7.4.5. | Electromagnets and electric motors with fully additive electronics |
7.4.6. | Passive components with fully additive electronics |
7.4.7. | Metamaterials and structural electronics with fully additive electronics |
7.4.8. | Fully additive 3D electronics for semiconductor packaging: Holst Centre (I) |
7.4.9. | Fully additive 3D electronics for semiconductor packaging: Holst Centre (II) |
7.4.10. | Additively manufactured antenna-in-package |
7.4.11. | 3D printed electronics and economies of scale |
7.4.12. | 3D printed electronics enable on-demand manufacturing |
7.4.13. | 3D printed electronics enable distributed manufacturing |
7.4.14. | Advantages and disadvantages of distributed manufacturing |
7.4.15. | On-demand manufacturing: US Army and NASA use nScrypt printer. |
7.4.16. | Opinions on 3D printed electronics and distributed on-demand manufacturing |
7.5. | 3D printed electronics: Summary |
7.5.1. | SWOT: 3D printed electronics |
7.5.2. | 3D printed electronics: Summary |
8. | ADDITIVE CIRCUIT PROTOTYPING |
8.1.1. | Multilayer circuit prototyping |
8.1.2. | Circuit prototyping and 3D electronics landscape |
8.1.3. | Print-then-plate: Partially additive PCB manufacturing |
8.1.4. | Print then ablate |
8.1.5. | Readiness level of additive manufacturing technologies |
8.1.6. | Company details and profiles |
9. | FLEXIBLE HYBRID ELECTRONICS - A RELATIVE OF 3D ELECTRONICS |
9.1.1. | 3D electronics and flexible hybrid electronics (FHE) |
9.1.2. | FHE Examples: Combing conventional components with flexible/printed electronics on flexible substrates |
9.1.3. | What counts as FHE? |
9.1.4. | Overcoming the flexibility/functionality compromise |
9.1.5. | Commonality with other electronics methodologies |
9.1.6. | Materials and technologies for FHE |
9.1.7. | FHE value chain: Many materials and technologies |
9.1.8. | SWOT Analysis: Flexible hybrid electronics (FHE) |
Slides | 369 |
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Forecasts to | 2032 |
ISBN | 9781913899936 |