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1. | EXECUTIVE SUMMARY |
1.1. | Drivers and restraints |
1.2. | Total market forecast |
1.3. | Technologies |
2. | INTRODUCTION |
2.1. | Printed Electronics |
2.2. | Printed Electronics: commercial failures |
2.3. | Printed Electronics: commercial successes |
2.4. | 3D Printing |
2.5. | 3D Printing: commercial applications |
2.6. | 3D Printing: hybrid machines |
2.7. | Lessons learned |
3. | TRADITIONAL PCBS |
3.1. | Traditional PCBs: history |
3.2. | Traditional PCBs: mounting components |
3.3. | Traditional PCBs: layers |
3.4. | Traditional PCBs: complexity |
3.5. | Traditional PCBs: geography |
3.6. | Traditional PCBs: prototyping |
3.7. | Traditional PCBs: mechanics |
3.8. | Traditional PCBs: heat |
3.9. | Traditional PCB: SWOT analysis |
4. | MATERIALS |
4.1. | Functional materials |
4.2. | Metals |
4.3. | Conductive thermoplastic filaments |
4.4. | Conductive plastics using graphene additives |
4.5. | Conductive plastics using carbon nanotube additives |
4.6. | Conductive inks |
4.7. | Ink requirements for 3D printed electronics |
4.8. | Conductive pastes |
4.9. | Conductive photopolymers |
5. | APPLICATIONS |
5.1. | Interconnects |
5.2. | Antennas |
5.3. | Microbatteries |
5.4. | Low volume manufacturing |
5.5. | Electromagnets |
5.6. | Ceramic capacitor |
5.7. | Organic Photovoltaic |
5.8. | Metamaterials |
5.9. | Ballistic rectifier |
5.10. | Piezoelectric device |
6. | TECHNOLOGIES |
6.1. | Extrude molten solder |
6.2. | Extrude molten solder: SWOT |
6.3. | Extrude conductive filament |
6.4. | Extrude conductive filament: SWOT |
6.5. | Inkjet |
6.6. | Inkjet: SWOT |
6.7. | Aerosol Jet |
6.8. | Aerosol Jet: SWOT |
6.9. | Paste extrusion |
7. | COMPETING TECHNOLOGIES |
7.1. | 3D Printer and conductive ink/paste/glue |
7.2. | CNC Milling |
7.3. | Laser Direct Structuring (LDS) |
7.4. | Benchmarking different processes (IME, MID, 3DP, aerosol) |
8. | PLAYERS |
8.1. | Voltera |
8.2. | Voltera: SWOT |
8.3. | BotFactory |
8.4. | BotFactory: SWOT |
8.5. | Nano Dimension |
8.6. | Nano Dimension: SWOT |
8.7. | Ceradrop |
8.8. | Ceradrop: SWOT |
8.9. | Optomec |
8.10. | Optomec: SWOT |
8.11. | IDS |
8.12. | IDS: SWOT |
8.13. | Neotech AMT |
8.14. | Neotech AMT: comparison |
8.15. | Neotech AMT: SWOT |
8.16. | Novacentrix and nScrypt |
8.17. | Pulse Electronics |
8.18. | Deceased |
9. | RESEARCH INSTITUTES |
9.1. | University of Texas at El Paso (UTEP) |
9.2. | Cornell University |
10. | MARKETS AND FORECASTS |
10.1. | End users |
10.2. | Player classification |
10.3. | Technology strengths and weaknesses |
10.4. | Opportunities |
10.5. | Consumer market |
10.6. | Education and research market |
10.7. | Professional PCB prototyping market |
10.8. | Industrial market |
10.9. | Total market forecast |
10.10. | Limitations of the forecast |
10.11. | Conclusions |
Slides | 112 |
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Forecasts to | 2029 |