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1. | EXECUTIVE SUMMARY AND CONCLUSIONS |
1.1. | Ten-year market forecasts in USD for all conductive inks and pastes split by application |
1.1. | Conductive inks and paste: everything is changing |
1.2. | Traditional Markets |
1.2. | Ten-year market forecasts in USD for all conductive inks and pastes split by application. PV excluded. |
1.2.1. | Photovoltaics |
1.2.2. | Touch screen market |
1.2.3. | Automotive |
1.2.4. | Sensors |
1.3. | Ten-year market forecasts in tonnes for all conductive inks and pastes split by application. PV excluded. |
1.3. | RFID |
1.4. | Emerging applications |
1.4. | Ten-year market forecast for micron-sized (non nano) conductive inks and pastes split by application |
1.4.1. | 3D antennas |
1.4.2. | ITO replacement |
1.4.3. | Stretchable inks |
1.4.4. | Desktop PCB printing |
1.4.5. | 3D Printed Electronics |
1.5. | Ten-year market forecasts for silver nanoparticle conductive inks and pastes split by application |
1.6. | Ten-year market forecasts for conductive inks and pastes in touch screens |
1.7. | Ten-year market forecasts for conductive inks and pastes in the automotive sector as de-foggers, seat heaters and occupancy sensors. |
1.8. | Ten-year market forecasts for conductive inks and pastes as piezoresistive and glucose sensors. |
1.9. | Conductive inks and pastes used in printing UHF RFID antennas in value and tonne |
1.10. | Conductive inks and pastes used in printing HF RFID antennas in value and tonne |
1.11. | Ten-year market forecasts for conductive inks and pastes in 3D antennas |
1.12. | Ten-year market forecasts for IME conductive inks and pastes in the automotive sector |
1.13. | Ten-year market forecasts for conductive inks and pastes in ITO replacement |
1.14. | Ten-year market forecasts for stretchable conductive inks and pastes in e-textiles |
1.15. | Ten-year market forecasts for stretchable conductive inks and pastes in 3D printed electronics. |
2. | CONDUCTIVE INKS AND PASTES |
2.1. | PTF vs Firing Paste |
2.1. | Different morphologies of micron-sized silver particulates used in conductive paste/ink making |
2.1. | These tables show the performance and processing conditions of screen-printable silver pastes. |
2.2. | Table listing the key suppliers of metallic powders/flakes and conductive inks/paste. |
2.2. | The process flow for making a conductive pastes. |
2.2. | Curing and sintering |
2.3. | Value chain |
2.3. | These charts show the curing behaviour of PTFTs using a box oven and UV heater. |
2.3. | Performance and typical characteristics of various silver nanoparticle inks on the market. |
2.4. | List of silver nanoparticle suppliers. |
2.4. | These charts show a typical firing profile for firing-type conductive pastes. |
2.4. | Silver nanoparticle inks |
2.5. | Silver nanoparticle inks are more conducting |
2.5. | Typical equipment used in curing silver PTFs |
2.6. | A roll-to-roll photosintering machine by Novacentrix |
2.6. | Curing temperature of silver nanoparticle inks |
2.6.1. | Enhanced Flexibility |
2.6.2. | Inkjet Printability |
2.7. | Price competiveness of silver nanoparticles |
2.7. | A Xenon photosetting machine as well as its lamp |
2.8. | This images show SEM images of flake and spherical Ag pastes after heat and photo curing. |
2.8. | Performance of silver nanoparticle |
2.9. | Value chain |
2.9. | Images comparing the packing of flake-based and nanoparticle-based conductive lines. |
2.10. | Conductivity values of different sputtered and printed conductive materials. |
2.11. | This measured data shows that silver nanoparticle inks can form lines that are both thinner and more conducting. |
2.12. | Melting temperature as a function of gold particle size |
2.13. | Current and projected roadmap for the curing temperature and resistivity level of silver nanoparticle inks. |
2.14. | Data showing the thermal curing behaviour of silver nanoparticle inks. It is observed that silver nanoparticle inks require curing temperatures comparable to PTF pastes. |
3. | SILVER NANOPARTICLE PRODUCTION METHODS |
4. | COPPER INKS AND PASTE |
4.1. | Spot price of silver as a function of year |
4.1. | Methods of preventing copper oxidisation |
4.1.1. | Superheated steam |
4.1.2. | Reactive agent metallization |
4.1.3. | Photocuring and photosintering |
4.2. | The annealing method is a key step in creating conductive tracks from copper. |
4.2. | Pricing strategy and performance of copper inks and pastes |
4.2. | List of companies supplying or researching copper or silver alloy powders, inks or pastes. |
4.3. | The performance and key characteristics of copper inks and pastes offered by different companies |
4.3. | Copper oxide nanoparticles |
4.3. | Apparatus and process for curing printed copper lines using Toyobo's superheated steam. |
4.4. | Creative copper conductive traces using reactive agent metallization |
4.4. | Silver-Coated Copper |
4.5. | Various photosintering machines |
4.6. | Comparing an ideal silver-coated copper vs the ones typically produced. |
5. | CONDUCTIVE PASTES IN THE PHOTOVOLTAIC MARKET |
5.1. | Background to the PV industry |
5.1. | Left: price history of silicon PV cells. Right: price levels and production volumes of crystalline silicon PV. The price levels are now around 30 cents per watt or less. |
5.2. | List of companies that went bankrupt, closed, restructured or sold equity at discount prices during the consolidation period. |
5.2. | Conductive pastes in the PV sectors |
5.3. | Alternative and improved metallization techniques |
5.3. | Shipped production for the top 10 suppliers of solar cells. |
5.4. | The industry has dramatically changed over the years. US Japan and Europe have lost their leading positions at various times whereas Japan has risen. |
5.4. | Silicon inks |
5.5. | Trends and changes in solar cell architecture |
5.5. | Comparing production volumes, measured in megawatts, of different solar cells technologies in 2013(red bars) and 2014 (blue bars). |
5.6. | Cost breakdown of a typical wafer-based silicon solar cells. |
5.6. | Market dynamics |
5.7. | Ten-year market forecasts for conductive paste in solar cells |
5.7. | The cost of silver conductive paste as an overall portion of the energy-generation cost of a silicon PV (in cents per watt peak) as a function of time. |
5.8. | Screen printed conductive lines on a typical wafer-based silicon PV. |
5.9. | The production process for a silicon PV showing when metallization and curing (firing) takes place |
5.10. | Typical curing profile of firing-type conductive pastes used in the photovoltaic industry. |
5.11. | Silver content per cell as a function of time. These are IDTechEx projections and underpin our market forecasts |
5.12. | The reduction in the silver content is made by possible by innovation in inks. |
5.13. | Survey results showing what the industry expected in the next decade |
5.14. | Predicted trend for minimum as-cut wafer thickness |
5.15. | Benefits of a silicon ink in improving solar cell efficiency |
5.16. | Current efficiency of select commercial PV modules. |
5.17. | Market share of different silicon solar cell architectures/technologies |
5.18. | Comparing the BSF and PERC cell architecture |
6. | AUTOMOTIVE |
6.1. | De-misters or de-foggers |
6.1. | Existing and emerging use cases of conductive inks in the interior and exterior of cars |
6.2. | Comparing the performance of a standard conductive paste as a de-froster when deposited on a PC and a glass substrate. |
6.2. | Car seat heaters |
6.3. | Seat sensors |
6.3. | Ten-year market forecast for conductive paste used in de-foggers |
6.4. | Structure of a typical printed seat heater |
6.5. | Resistance vs temperature behaviour of a PTF carbon ink |
6.6. | Ten-year market forecasts for the use of conductive inks (carbon plus silver) in car seat heaters |
6.7. | Operation of a FSR |
6.8. | Response curve of a typical FSR from IEE. Product name: CP 149 Sensor |
6.9. | Examples of FSR individual sensors from IEE |
6.10. | Ten-year market forecasts for the use of conductive inks and pastes as occupancy sensors in cars. |
7. | 3D PRINTED ELECTRONICS |
7.1. | Progress in 3D printed electronics |
7.1. | Ten-year market projections for 3D printing materials split by SLA/DLP, extrusion, metal powder, binder jetting, etc. |
7.1.1. | Nascent Objects |
7.1.2. | Voxel8 |
7.1.3. | nScrypt ad Novacentrix |
7.2. | University of Texas at El Paso (UTEP) |
7.2. | Plastic filaments used in 3D printing and suppliers thereof |
7.3. | Plastic powders used in 3D printing and suppliers therefore |
7.3. | Ten-year market projections for conductive inks and pastes in 3D printed electronics |
7.4. | Examples of embedded and metallized 3D printed objects. |
7.5. | Nascent Objects seeks to modularize electronic components so that they can placed inside 3D printed objects and upgraded (exchanged) when new versions arrive |
7.6. | A Voxel8 3D printed electronics machine |
7.7. | A 3D printed electronics object with embedded circuitry |
7.8. | A 3D printed quadcopter with 3D printed embedded circuit |
7.9. | (Left) Photonically-cured copper in and (right) nScrypt's patented SmartPump |
7.10. | 3D printed electronics objects by University of Texas |
7.11. | IDTechEx market forecasts for conductive inks and pastes |
8. | TOUCH PANEL EDGE ELECTRODES |
8.1. | Narrow bezels change the market |
8.1. | Schematic of a touch screen system and a close-up of printed edge electrodes |
8.2. | Table showing the linewidth resolution of various processes used in making touch screen bezels |
8.2. | Ten-year market projections for conductive inks and paste in the touch screen industry |
8.3. | Ten-year market forecasts for conductive inks and pastes in value split by touch screen device type |
8.4. | Ten-year market forecasts for conductive inks and pastes in tonne split by touch screen device type |
9. | CONDUCTIVE INKS IN RFID |
9.1. | RFID market size and business dynamics |
9.1. | Examples of RFID tags |
9.1. | Table outlining the operational frequency and main features of each RFID tag. |
9.2. | Average sales price of passive RFID tags in USD cents |
9.2. | Typical examples of RFID antennas |
9.2. | Processes, Material Options and Market Shares |
9.3. | Market projections |
9.3. | The approximate cost breakdown of different components in a typical UHF RFID tag |
9.4. | RFID tag figures and ten-year forecasts by application in billion USD |
9.5. | Cost estimates for making RFID antennas using different production processes |
9.6. | A Suica transit card widely used in Japan's transport network. The antenna consist of a printed silver conductive track |
9.7. | Comparing the printing speed, thickness and applications of different printing techniques |
9.8. | Schematics of different printing processes used in RFID antenna production |
9.9. | Examples of printed RFID antennas. |
9.10. | Ten year market forecast for the use of conductive inks in UHF RFID antennas split by ink type. |
9.11. | Ten year market forecast for the use of conductive inks in HF RFID antennas split by ink type. |
10. | PRINTED AND FLEXIBLE SENSORS |
10.1. | Piezoresistive |
10.1. | Typical construction and behaviour of piezoresistive force sensors. |
10.2. | The IDTechEx market and technology roadmap for piezoresistive sensors |
10.2. | Glucose sensors |
10.3. | Ten-year market projections for piezoresistive sensors at the device level |
10.4. | Different glucose test strips on the market. |
10.5. | The anatomy of a glucose test strip. The working electrode here is carbon based |
10.6. | Manufacturing steps of a Lifescan Ultra glucose test strip. |
10.7. | Benchmarking printing vs. sputtering in glucose test strip product. Here, 5 refers to the strongest or highest. |
10.8. | Printed glucose test trip market. |
11. | 3D ANTENNAS AND CONFORMAL PRINTING ON CURVED SURFACES |
11.1. | Laser Direct Structuring and MID |
11.1. | Many components in a typical consumer electronics device such as a mobile phone are or can potentially be printed. |
11.2. | Schematic showing the sales volume of phones. |
11.2. | Aerosol deposition |
11.3. | Others ways of printing structurally-integrated antennas |
11.3. | The production process using LDS. |
11.4. | A typical smartphone antenna made using LDS. |
11.4. | Market projections for printed 3D antennas |
11.5. | Examples of LDS products on the market. |
11.6. | The aerosol deposition process and its key features. |
11.7. | The core components making up an aerosol deposition machine |
11.8. | Aerosol deposited 3D antennas directly on mobile phone components |
11.9. | Comparing the LDS vs aerosol processes. |
11.10. | (left) An antenna dispensing machine and (right) an antenna being printed (dispensed) directly on the phone case. |
11.11. | Ten-year market projections for the use of conductive inks (silver nano inks) in printing 3D antennas. |
12. | THERMOFORMED OR IN-MOULD ELECTRONICS |
12.1. | Automotive |
12.1. | The process starts by printing on a flats or 3D substrate before being thermoformed into a 3D shape. |
12.2. | Comparison of overhead control panels |
12.2. | Ink requirements in in-mould electronics |
12.3. | Other materials used in in-mould electronics |
12.3. | The formation of car overhead consoles using in-mould electronics is a multi-step process. |
12.4. | These images demonstrate the impact of ink formulation on its performance after being stretched. |
12.4. | In mould electronics in consumer electronics |
12.5. | Air conditioning controller unit for a car. |
12.6. | Examples of thermoformed products made using a CNT-on-PC film |
12.7. | Increase in resistance as a function of change in length. |
12.8. | Two prototype examples using PEDOT and CNT |
12.9. | Example of how in-mould electronics (here referred to as structural electronics) can result in the formation of simple and elegant designs. |
12.10. | Schematic showing how TactoTek makes its structural or in-mould electronics. |
12.11. | Ten-year market projections for IME consoles in the automotive sector |
12.12. | Ten-year market projections for IME conductive inks in the automotive sector. |
13. | STRETCHABLE INKS FOR ELECTRONIC TEXTILES |
13.1. | Electronic textile industry |
13.1. | Medium-term market projections for smart textiles. |
13.2. | Some examples of prominent e-textile products are shown in this slide. |
13.2. | Stretchable inks and products |
13.3. | Applications and ten-year market projections market forecast |
13.3. | Percentage of e-textile players using each material type |
13.4. | Microcracks and voids appear in a printed conductive lines under stretch causing it to lose its conductivity. |
13.5. | Stretchable inks containing only Ag flakes show great resistivity variations under stretch compared to inks containing a distribution of particle sizes. |
13.6. | Printing a typical conductor on a fabric or textile is currently a four-step process |
13.7. | Examples of stretchable conductive paste |
13.8. | Examples of wearable products employing conductive inks. |
13.9. | Ten-year market projections for stretchable conductive inks in e-textiles. |
14. | PRINTED CIRCUIT BOARD MANUFACTURING AND PROTOTYPING |
14.1. | Background to the PCB industry |
14.1. | Left: example of pre-PCV electronics wit rats nest wiring. Right: example of early PCB. |
14.2. | Examples of through-hole (left) and SMD PCB (right). |
14.2. | 'Printing' PCBs for the hobbyist and DIY market |
14.2.1. | Comments |
14.3. | 'Printing' professional multi-layer PCBs |
14.3. | Schematic using a typical construction of a double-layer (left) and multilayer (right) PCB. |
14.4. | Breakdown of the PCB market by the number of layers |
14.4. | Comparison of different PCB techniques |
14.5. | Traditional PCBs are a mature technology |
14.6. | Production steps involved in manufacturing a multi-layer PCB. |
14.7. | PCB market by production territory |
14.8. | PCB design files are often sent to the other side of the world to be manufactured and shipped back |
14.9. | CNC machine create double-sided rigid PCB. |
14.10. | AgIC have developed a specially-coated PET substrate for inkjetting |
14.11. | Left: example of a desktop printed single-sided PCB on a plastic (flexible) substrate. Right: example of a Cartesian desktop PCB printer. |
14.12. | Example of a bot factory machine in the IDTechEx office |
14.13. | Professional multi-layer desktop PCB printer by NanoDimension |
14.14. | Example of a multi-layer professional PCB printed using a professional desktop PCB printers. |
14.15. | Classification and structure of FPCB |
14.16. | Example of a PCB manufactured using inkjet printed photoresist. Here, printing replaces photolithography |
14.17. | Comparison of different PCB techniques |
15. | ITO REPLACEMENT (TRANSPARENT CONDUCTING FILMS) |
15.1. | Examples of application that use a transparent conductive layer (glass or film). |
15.1. | Market forecast for transparent conductive films |
15.2. | Changing market requirements |
15.2. | Market forecast for transparent conductive films split by TCF technology |
15.3. | The sheet resistance requirements scale with the display size. |
15.3. | A brutal consolidation sets in |
15.4. | Progress and opportunities for conductive inks |
15.4. | Sheet resistance requirements and efficiency of organic photovoltaic. |
15.4.1. | Embossing followed by silver nanoparticle printing |
15.4.2. | Self-assembled silver nanoparticle films |
15.4.3. | Inkjet printed silver nanoparticles as transparent conducting films |
15.5. | Sheet resistance as a function of radius curvature for ITO films. ITO cracks and its sheet resistance goes up when the film is bent. |
15.5. | Market Projections |
15.6. | Sheet resistance as a function of bending cycle or angle for different TCF technologies such as metal mesh, PEDOT, silver nanowires and carbon nanotubes. |
15.7. | ITO film price drop from $35/sqm to $18/sqm in a space of two years |
15.8. | Comparing the market forecast for medium-sized (e.g., AIOs) touch screens pre and post 2012. |
15.9. | Quantitatively benchmarking different transparent conductive film technologies |
15.10. | The process flow for making TCFs developed by NanoGrid based in Suzhou |
15.11. | Printed silver nanoparticle inks and a large touch module |
15.12. | ClearJet inkjet prints drops of specially formulated silver nano inks, which then self-assemble into a pattern shown above to form a conductive network that is also transparent |
15.13. | Ten-year market projections for the use of silver nano inks as an ITO replacement |
16. | CONDUCTIVE PENS |
16.1. | Conductive pattern drawn using an ink supplier by Electronics Inks. The pen shown in the photo is the conductive ink that Sakura and Electroninks jointly developed. |
16.2. | Examples of applications and performance levels of a conductive ink developed by Dream Inks in China. |
16.3. | Colloidal's ink curing and resistivity |
16.4. | Example of conductive pattern inkjet-printed using an Epson printed and Colloidal's inks. |
17. | MOBILE PHONE DIGITIZERS- FIRST HIGH-VOLUME MARKET FOR SILVER NANOPARTICLE INKS? |
17.1. | Samsung to replace the etched digitizers with printed ones using silver nanoparticle inks |
18. | OLED LIGHTING MARKET |
18.1. | OLED Lighting market dynamics and challenges |
18.1. | Commercial and prototype OLED vs existing (2013 data) LED performance levels |
18.2. | Examples of LED and OLED lighting installations showing that LED can achieve effective surface emission thanks to the use of waveguides. |
18.2. | OLED lighting in search of a unique |
18.3. | Cost projections of OLED lighting |
18.3. | Flexible, thin and light-weight OLED lighting products launched by LG Chem and Konica Minolta. |
18.4. | Cost projections in $/Klm as a function of year. |
18.4. | OLED lighting market forecast |
18.5. | Requirements from conductive inks in OLED lighting |
18.5. | Examples of latest OLED lighting installations in museums, nightclubs, festivals and libraries. |
18.6. | Ten-year market projections for OLED lighting as a function of year segmented by end application |
18.6. | Market projections |
18.7. | Structure of a typical OLED lighting device |
18.8. | Ten-year market projections for silver nanoinks in OLED lighting applications. |
19. | COMPANY INTERVIEWS |
19.1. | Agfa-Gevaert N.V. |
19.2. | AgIC |
19.3. | Bando Chemical Industries |
19.4. | BeBop Sensors |
19.5. | BotFactory |
19.6. | Cartesian Co |
19.7. | Cima NanoTech Inc |
19.8. | Clariant Produkte (Deutschland) GmbH |
19.9. | ClearJet Ltd |
19.10. | Colloidal Ink Co., Ltd |
19.11. | Conductive Compounds |
19.12. | Daicel Corporation |
19.13. | DuPont |
19.14. | DuPont Advanced Materials |
19.15. | Electroninks Writeables |
19.16. | Flexbright Oy |
19.17. | Fujikura Kasei Co Ltd |
19.18. | Genes 'Ink |
19.19. | Henkel |
19.20. | Hicel Co Ltd |
19.21. | Inkron |
19.22. | InkTec Co., Ltd |
19.23. | Intrinsiq Materials |
19.24. | Komori Corporation |
19.25. | KunShan Hisense Electronics |
19.26. | Lord Corp |
19.27. | Methode Electronics |
19.28. | Nagase America Corporation |
19.29. | NanoComposix |
19.30. | Nano Dimension |
19.31. | NANOGAP |
19.32. | Novacentrix |
19.33. | O-film Tech Co., Ltd |
19.34. | Optomec |
19.35. | Perpetuus Carbon Technologies Limited |
19.36. | Printechnologics |
19.37. | Promethean Particles |
19.38. | Pulse Electronics |
19.39. | PV Nano Cell |
19.40. | Raymor Industries Inc |
19.41. | Showa Denko |
19.42. | Sun Chemical |
19.43. | Tangio Printed Electronics |
19.44. | The Sixth Element |
19.45. | T-Ink |
19.46. | Toda Kogyo Corp |
19.47. | Tokusen USA Inc. |
19.48. | Ulvac Corporation |
19.49. | UT Dots Inc |
19.50. | Vorbeck Materials |
19.51. | Voxel8 |
19.52. | Xerox Research Centre of Canada (XRCC) |
19.53. | Xymox Technologies |
20. | COMPANY PROFILES |
20.1. | Advanced Nano Products |
20.1. | Properties of the low-melting-point alloy before and after melting (structure and conductivity) |
20.1. | Screen Printable Silver Paste |
20.2. | Other Silver Pastes |
20.2. | Electron microscope images of the Napra-developed copper paste (left) and of commercially available resin silver paste (right) |
20.2. | AIST and NAPRA |
20.3. | Amogreentech |
20.3. | Resistivity of silver and copper pastes (Commercially available copper pastes: A, B, and C; Napra-developed copper paste: D; and commercially available silver paste: E) |
20.3. | Inkjet Printable Inks |
20.4. | Applied Nanotech products |
20.4. | Resistivity vs. cure temperature for glass-coated silver nanoparticles |
20.4. | Applied Nanotech Inc. |
20.5. | Asahi Glass Corporation |
20.5. | The annealing process and equipment used for Hitachi Chemical's inks and pastes |
20.5. | Ferro's metal products |
20.6. | Outline of Noritake product list |
20.6. | Performance of Hitachi Chemical's inks compared to printed circuit board solutions |
20.6. | Asahi Kasei |
20.7. | Cabot |
20.7. | The Pulse Forge principle |
20.7. | Silver and carbon pastes offered by Toyobo |
20.8. | Performance of Hitachi Chemical's inks compared to printed circuit board solutions |
20.8. | Copper pastes developed by Toyobo |
20.8. | Chang Sung Corporation |
20.9. | Cima Nanotech |
20.9. | Flexographic formulation of Vor-Ink from Vorbeck |
20.10. | Packaging Natralock® with Siren™ Technology |
20.10. | Ferro |
20.11. | Giga Solar Materials Corp |
20.12. | Harima |
20.13. | Hitachi Chemical |
20.14. | Kishu Giken Kogyo Co.,Ltd. |
20.15. | Liquid X Printed Metals, Inc. |
20.16. | Indium Corporation |
20.17. | NanoMas Technologies |
20.18. | Noritake |
20.19. | Novacentrix |
20.20. | Novacentrix PulseForge |
20.21. | Samsung (former Cheil Industries) |
20.22. | Taiyo |
20.23. | Toyobo |
20.24. | Vorbeck |
IDTECHEX RESEARCH REPORTS AND CONSULTANCY | |
TABLES | |
FIGURES |
Pages | 350 |
---|---|
Tables | 16 |
Figures | 182 |
Companies | 77 |
Forecasts to | 2026 |