American Institute of Physics (AIP)

KAERI (SMART-C)

The Korea Atomic Energy Research Institute (KAERI) is the national nuclear energy research organization of South Korea.

Low-Loss Materials: The Key Enablers for High-Speed Connectivity

Transmission losses become increasingly significant as communication systems move toward higher frequencies, making low-loss materials essential to preserve signal strength and integrity. These materials are critical for technologies such as 5G mmWave and future 6G telecommunications which is expected to see deployment around 2030, as well as for automotive radar systems for advanced driver assistance systems (ADAS). Similarly, data center infrastructure is shifting toward ultra-high data rates exceeding 200Gbps amplifying the need for materials that can perform reliably and maintain signal integrity under such demanding conditions.

Kyocera (LTCC)

Kyocera Corporation is a ceramics and electronics manufacturer, founded in 1959. Its headquarters are in Kyoto, Japan. As part of its solutions portfolio, Kyocera offers low temperature co-fired ceramics (LTCC) packages and substrates and organic RF packages for applications in 5G mmWave and transceivers and switches for applications in data centers.

TMYTEK

TMYTEK is a company that provides 5G mmWave solutions. IDTechEx spoke with founder Su-Wei Chang back in 2021. In September 2025, IDTechEx caught up with Su-Wei Chang to discuss the current status of RIS, phase-array antennas, and the roadmap to 6G.

6G: Key Hardware Technologies and Future Development Roadmap

The evolution of telecommunications continues with each decade, and as 5G becomes widespread, attention is shifting to the next generation: 6G. Promising next-level capabilities compared to next generation, 6G will offer data rates reaching terabits per second (Tbps), microsecond-level latency, and ultra-high level of network reliability.

Which Substrate Tech Rules for 5G and 6G AiP?

Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Previously, antennas were positioned on PCBs; now, there's a shift towards integrating antennas directly onto the same package as the RF chip.

Fast Communications - IDTechEx Explores 5G and 6G Telecoms

As the hunger for high-speed internet and constant connection increases, so too does the developments of 5G and 6G networks. The technology that makes this possible is happening right down in the small area of the antenna within the device, and low-loss materials and alternative substrates can offer ways of maintaining a strong connection.

AiP Market Dynamics: Drivers & Challenges in 5G & 6G

Antenna-in-package (AiP) technology is essential for high-frequency telecommunications, as it enables the integration of antennas with RF components directly into semiconductor packages, unlike traditional discrete antennas. This advancement, tailored for mmWave applications and potentially extending into the sub-THz spectrum for 6G, promises much smaller footprints and enhanced performance.

TMYTEK (Antenna in Package Technology)

TMYTEK is a company that provides 5G mmWave solutions. IDTechEx spoke with founder Su-Wei Chang back in 2021. In February 2024, IDTechEx caught up with Su-Wei on their latest advancements in mmWave antenna technology. Please see below for the write-up based on the interview.

JSR Corporation

JSR Corporation is a Japanese company that specializes in materials innovation for various industries, such as digital solutions, life sciences, and plastics. IDTechEx spoke with JSR at Semicon Europe 2023

Advancing Integration in Antenna Packaging Technologies for 5G and 6G

Millimeter-wave (mmWave), previously confined to military, satellite, and automotive radar applications, has now entered the mobile communications frequency spectrum, offering high data throughput of up to 20 Gbps with an ultralow latency of just 1 ms.

Antenna in Package (AiP) for 5G and 6G 2024-2034

Forecasts taken from IDTechEx report "Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets"

Advanced Semiconductor Packaging: Trends and Growth Drivers

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.

The "Hidden" Opportunity in Low-loss Materials for 5G

When thinking of the applications of low-loss materials in 5G devices, the first that comes to mind for most is 5G smartphones. After all, low-loss materials are integral in enabling advanced 5G antennas-in-packages (AiP) for smartphones, and high-profile smartphone manufacturers like Apple have gone back and forth about which low-loss material they chose for their 5G antennas in their flagship phones like the iPhone.

Taiyo Ink: 5G Materials

Taiyo Ink MFG Co., Ltd. are a manufacturer of solder resist and dielectric materials based in Japan. IDTechEx spoke with Taiyo Ink on their dielectric material products for 5G applications.

Showa Denko Group: 5G Materials

Showa Denko Group are a group of Japanese chemical manufacturers; their subsidiary, Showa Denko Materials, sell organic low loss materials for 5G applications. IDTechEx spoke with Showa Denko Materials about their 5G materials portfolio.

Kyocera: 5G Materials

Kyocera is a Japanese material supplier offering a broad line of semiconductor packages and assembly services based on advanced ceramic and organic material technologies. IDTechEx spoke with Masaaki Minami, Marketing Manager at Kyocera, on its 5G materials.