Corning

Barrier films and thin film encapsulation: key technology, trends

Flexible and foldable high-performance barrier or encapsulation technology had long represented a technology challenge. The industry spent a decade and a half optimizing the approaches and the processes to achieve large-area production-grade results. The development however has not ended. Indeed, the commercial journey towards flexible and foldable devices is only just beginning. As such, the development of flexible barrier technologies still has far to travel.

Frankfurt Laser Company

Frankfurt Laser Company are an international distributor of laser diode products and a custom laser solution provider.

Nanosys

Nanosys is a market leader in quantum dot material and applications.

Apple launches new clean energy fund in China

Apple announced a new first-of-its-kind investment fund in China to connect suppliers with renewable energy sources. As part of Apple's commitment to address climate change and increase the use of renewable energy within its supply chain, 10 initial suppliers and Apple will jointly invest nearly $300 million over the next four years into the China Clean Energy Fund.

EU funded collaboration to make perovskite solar cells market reality

Aan ambitious 3-year European Union funded project, "ESPResSo" (Efficient Structures and Processes for Reliable Perovskite Solar Modules), that gathers known leaders in the field of perovskite PV technology to revolutionize Europe's photovoltaics (PV) industry.

New thin transparent and lightweight touchscreen pressure sensor array

Researchers have demonstrated a new technology for 'force sensing' that can be added to any type of display, including flexible devices, and potential other uses go far beyond touch screen displays on mobile devices.

Ultimaker

Technology Analyst Dr Bryony Core caught up with Ultimaker to find out more about their popular printers and supporting software.

Printed meds could reinvent pharmacies, drug research

A new process can print multiple medications onto a single dissolvable strip, microneedle patch or other surface.

COI Ceramics Inc.

COI Ceramics are custom producers of CMC parts as well as manufacturers and distributors of SiC fibres. Dr Richard Collins interviewed Steven Atmur (Business Development).

High-performance Roll-to-Roll processing for flexible electronics

Functionalized and curved surfaces made of glass or plastic, rollable displays, high-quality bended surfaces for architecture or interior design in automotive or luxury furniture sector - flexible materials with integrated functionalities are not just a technological trend but capture markets already.

Ultra-thin glass is up and coming

Fraunhofer FEP is an experienced partner for technological developments, known for testing the limits of new materials and for optimization of those materials with respect to market demands. Currently, researchers are dedicating their efforts to investigations of ultra-thin glass. The focus of recent activities is sheet-to-sheet coatings on large-area ultra-thin glass.

Status of flexible encapsulation to enable flexible electronics

In 2020 flexible barrier manufacturing for flexible electronic devices such as displays will be a market worth more than US$184 million according to IDTechEx Research. That equates to 3.8 million square meters of flexible barrier films for electronics.

Award, thermally conductive gel for advanced semiconductor packaging

Dow Corning has announced that it garnered a 2015 3D InCites Award for new Dow Corning® TC-3040 Thermally Conductive Gel, a silicone-based thermal interface material designed to manage heat and support reliable performance for advanced semiconductor flip chip applications.

Flexible barrier technologies: a brief review of technology options

Back in 2014, we witnessed the launch of the first displays deposited on flexible substrates, and the first efforts to encapsulate them. There are significant differences in the encapsulation techniques utilized by each of the companies commercializing flexible electronics. These differences signify the variety of technologies available, in terms of deposition as well as material options for the barrier films, some of which are discussed in this article

Corning announces collaboration with OLEDWorks

Corning Incorporated has announced a collaborative agreement with OLEDWorks to develop unique, flexible, and conformable OLED lighting solutions using Corning Willow Glass as an integrated substrate.

New Dow Corning EA-4600 hot melt adhesive

Dow Corning introduced new Dow Corning® EA-4600 Hot Melt Room-Temperature Vulcanization (RTV) Black Adhesive for improved assembly of consumer electronics and other demanding high-volume manufacturing operations.

Is there a future for flexible glass?

In the last three years, we have seen several companies showcasing ultrathin glass at tradeshows around the world. These glass substrates are so thin that they can be bent and rolled almost like a plastic film. But despite the fanfare surrounding the technical prowess, the future of flexible glass remains uncertain.