Printed, Flexible and Organic Electronics

Printed, Flexible and Organic Electronics

Printed Electronics, being thin film silicon or inorganic or organic semiconductors, can be used to form Thin Film Transistor Circuits (TFTCs), such as replacing the functionality of simple silicon chips. TFTCs also employ thin film conductors and dielectrics and the ultimate objective is to make many different components at the same time - such as displays, batteries, sensors, microphones etc using the same materials or at least the same deposition techniques thus saving cost and improving reliability. Some TFTCs will be capable of covering large areas to affordably form electronic billboards, smart shelves and so on. They will be lightweight, rugged and mechanically flexible. Often they will be made by rapid, high-volume reel-to-reel processing even forming a part of regular printing processes for graphics. These circuits will be cheap enough to permit electronics where envisaged silicon chips are always or almost always too expensive, where multiple components and needed, and where silicon is impracticle (e.g. not flexible, brittle, thick etc).
Filtered by:
Printed, Flexible and Organic Electronics
13 Jun 2024

Silver Flake-Based Conductive Inks

This premium article explores silver flake-based conductive inks.
Included are:
7 Jun 2024

Segmenting the Conductive Inks Market by Formulation and Application

The conductive inks market will grow to exceed US$6.5 billion by 2034 but remains a highly segmented industry, underpinning both photovoltaics and the emerging field of printed electronics. Taking stock of the different outlooks for the myriad of conductive ink types and the various application areas is a complex task. IDTechEx has tackled this problem by assessing the market for different conductive ink types across 15 application areas and providing granular ten-year market forecasts.
6 Jun 2024

Copper Conductive Inks

This premium article discusses copper conductive inks.
Included are:
3 Jun 2024

3D Electronics and Additive Electronics in the Automotive Industry

With 3D electronics, bulky PCBs can be replaced, resulting in sleek and integrated designs. The automotive industry is one of the largest sectors benefiting from this technology, as electronics can be printed in a thin layer onto surfaces or integrated within components, which can be particularly useful for human-machine interfaces (HMIs).
30 May 2024

Emerging Opportunities for Conductive Inks

This premium article explores emerging opportunities for conductive inks.
Included are:
28 May 2024

EEG for Brain Computer Interfacing and Dry Electrode Innovations

This premium article will introduce electroencephalography (EEG) and related innovations in dry electrode technology.
Included are:
22 May 2024

Conductive Inks Market 2024-2034: Technologies, Applications, Players

IDTechEx Report: Dr Conor O'Brien and Dr Jack Howley
21 May 2024


This presentation was provided by Noctiluca to IDTechEx.
Included are:
17 May 2024

Conductive Inks Market 2024-2034

Forecasts from the IDTechEx Research report "Conductive Inks Market 2024-2034: Technologies, Applications, Players"
Included are:
13 May 2024


DoMicro offer technology consultancy and research and development (R&D) services for the flexible hybrid electronics and micro device industry. This profile provides an update based on the information gathered from LOPEC 2024.
10 May 2024

Printed Electronics in Electrified and Autonomous Mobility

Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector. These automotive meta-trends are driving drastic changes in electronic component requirements and present a high-volume opportunity for printed electronics to capitalize on.
7 May 2024

Heraeus — Conductive Inks

Heraeus are a German technology company, with a broad portfolio including electronics, healthcare and industrial applications. This summary profile will focus on conductive inks and pastes.
Included are:
3 May 2024

Webinar - 3D/Additive Electronics: New Methods for New Applications?

Thursday 16 May 2024 - An overview of 3D electronics including electronics on 3D surfaces, in-mold electronics and fully additive electronics; Technology benchmarking on conventional and emerging metallization methods; Discussion of the status, challenges and opportunities across the whole 3D electronics industry; Market opportunities and outlook
3 May 2024

Seat Occupancy Sensors & Gaming - Exploring Printed & Flexible Sensors

Sensors act as a middle ground between the physical and digital. They measure all sorts of variables from touch, temperature, and heart rate across many different sectors, which IDTechEx's report "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets" explores in detail. As technology continues to become streamlined and autonomous, there is a great demand for multi-functionality and seamlessness, meaning a high demand for sensors that can be printed and applied to flexible surfaces. IDTechEx explores the main sectors where this technology is in most demand.
3 May 2024


Teca-Print is a Swiss company specializing in pad printing. This profile offers an overview of the company.
1 May 2024


ioTech are an early-stage company focused on the development of non-contact laser-assisted deposition technology. This profile offers an update on their progress from the LOPEC 2024 event.
1 May 2024


HELIOSONIC printing technology, developed by ALTANA, utilizes the laser-induced forward transfer (LIFT) process, enabling digital non-contact deposition. This profile provides an update on their development as obtained from LOPEC 2024.
1 May 2024

Nano Dimension

Nano Dimension provides products and services for additive manufacturing of printed circuit boards and other electronic devices using an in-house approach.
Included are:
1 May 2024

TNO (Holst Centre)

This profile provides an update on TNO's activity in improving the sustainability of in-mold electronics (IME), incorporating information gathered from LOPEC 2024.
1 May 2024


Embega specializes in materials and system design, as well as printing technologies and processes to facilitate the transition of printed electronics from the lab to fab. This profile gathers information collected from LOPEC 2024.