SAFI-Tech

SAFI-Tech

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SAFI-Tech develops No-Heat SAC305™ liquid metal microcapsules, enabling low temperature processing of the industry's standard soldering alloy for electronics assembly. No-Heat SAC305 microcapsules can be precisely placed, selectively activated, and processed at ambient temperatures to form fully-metallic interconnects without the time, expense, and stress of high temperature reflow processes. SAFI-Tech's no-heat paradigm offers several advantages to design and assembly engineers: more choices for substrate and component materials; innovation and miniaturization for thinner, lighter, flexible products; faster volume throughput making conductive interconnects in seconds; better manufacturing yields by eliminating thermal defects; reduced energy costs and CO2 emissions with lower energy consumption.
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