Smart Labels Europe 2003

Conferences - Smart Labels Europe 2003

29 - 30 September 2003

* Wal-Mart - the world's largest company reports on their RFID developments * First public announcement of disposable moving color displays * Hewlett-Packard - how they intend to use RFID * Plus NCR, Manchester Airport Group, National Library of Singapore, Telecom Italia and many more... "The conference breaks the mould of 'same product, same time' by introducing new subjects and themes. Excellent value and interest." Andrew Price, British Airways, UK "A superb think tank and survey of the implementable as well as technical barriers." Dr Berman, Quantum Tag, South Africa The Big Picture: RFID & Beyond Over 250 senior company delegates are expected at the fourth Smart Labels Europe conference focusing on RFID, Smart Packaging and Smart Labels. Hear from a day of users, most of whom have never before publicly spoken on their activities with RFID. Presenters include Wal-Mart, Hewlett-Packard, NCR, Manchester Airport Group, the National Library of Singapore, Telecom Italia and two dozen others. A day dedicated to the latest technologies and ultra low cost electronic components (displays, sensors etc) ensure you will take away the latest in the industry, along with the opportunity to network with many potential customers at Europe's largest conference on RFID. Scroll down for more details.

The Big Picture: RFID & Beyond

Smart Labels cover a huge spectrum of radically fast developing technologies and applications. For example, in 2007 the global radio frequency identification (RFID) market is expected to be $4 billion (Source: IDTechEx Market Research) with exponential growth and use thereafter. The uses of the technology and their impact are tremendous - from improving supply chain efficiencies by a factor of ten to creating secure and more efficient airports, manufacturing and archiving. Beyond identification only, RFID is being combined with sensors to monitor the condition and status of items, and enables new markets and consumer benefits.
The fourth Smart Labels Europe 2003 conference focuses on all these topics with users' perspectives and experiences, case studies, technologies, challenges and the future. The industry is now gearing up with large orders beginning to be placed; this is the ideal event to attend for industry intelligence, technology knowledge and networking. Hosted wholly by IDTechEx, organisers of the World's largest conferences on smart labels and independent consultants in smart labels and smart packaging. We are designing an original and exciting conference you cannot afford to miss. All conference attendees also receive * attendance at the "Meet the Experts" dinner at the world famous Kings College, Cambridge where Henry VI laid the foundation stone in 1441 (see below) * conference proceedings containing details of all presentations, and a glossary and white papers * at least five different samples of smart labels for every delegate * three months subscription to the IDTechEx web journal Smart Labels Analyst worth $160 * free email helpline access for one month * attendance to the exhibition * transport to the conference venue and dinner from nominated hotels * a 20% discount on all IDTechEx publications when purchased while registering for the conference or at the event

Hear from Users Experiences and Cutting Edge Technology Developments

The primary focus of this executive conference is be radio frequency tagging where the tag is cheap enough to be disposable or left on a product through life, where they have potential for high volume sales and multiple paybacks; and smart packaging, enhancing the functionality of RFID. The conference is divided up over two days: the first day is dedicated to users only and will cover presentations from actual and potential users discussing their needs and experiences with the technology. The second day will have presentations from leading suppliers with new innovations and many exciting announcements and technology developments. Post conference workshops completely cover RFID and Smart Packaging topics, bringing you up to date with the very latest developments and market information. A new third workshop will cover Implementing RFID, allowing those wishing to take the step further learn how to do so.