Evolution Roadmap of Semiconductor Packaging

02 January 2024 by Dr Yu-Han Chang
Innovation roadmap for semiconductor packaging (including: the advanced semiconductor packaging path for High Performance Computing, and an overview of interconnection technique in semiconductor packaging).
Login or Register You are not logged in. Please login or register with idtechex.com for more details about premium content from IDTechEx.

For the full analysis of this sector, see the report Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications.