Die Attach Materials for Power Electronics in Electric Vehicles 2020-2030
This report investigates the market for various die and substrate attach materials used in power electronics in various electric vehicles. It builds a detailed quantitative model to forecast the addressable market size for die as well as substrate attach materials in various power electronic functions in all manners of electric vehicles. It also develops ten-year market forecasts, in value and mass, segmenting the market by material type. The materials considered herein include nano silver sintering, micro-silver sintering, Cu sintering, SAC and other solders, and transient liquid phase bonding materials.
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