Metal-organic framework (MOF) materials for carbon capture, water harvesting, HVAC, chemical separations and purification, gas storage, and other early-stage applications with player analysis, trends, and forecasts.
Assessment of emerging PFAS alternatives in critical application areas: hydrogen economy, sealing, 5G, electric vehicles, sustainable packaging. Extensive analysis of current and proposed regulations limiting the use of forever chemicals.
Compound Semiconductors, Transceivers, Indium Phosphide/InP PICs, Thin-Film Lithium Niobate/TFLN PICs, PICs for Quantum, Light-based Interconnects, Manufacturing, Materials, Co-Packaged Optics
Covering sustainable electronics, green electronics, materials and manufacturing printed circuit boards (PCBs), integrated circuits (ICs), e-waste, energy efficiency, water management, and electronics legislation.
Decarbonization of power, solar, wind, geothermal, nuclear, fuel cells, batteries, energy efficiency (thermal, IT, electrical), carbon credits, green concrete, manufacturing, scope 2 and scope 3 emissions reductions, and market outlook
Radars for autonomous cars & robotaxis, long-range radar, short-range radar, radar cocooning, 4D imaging radar, high-channel-count radars, semiconductor technologies for radar, waveguide antenna, automotive radar forecasts
High-Performance Computing, Exascale Supercomputers, AI Chips, CPUs, GPUs and Accelerators, Memory, Storage, Advanced Semiconductor Packaging, Networking, Interconnects and Thermal Management.
Ten-year forecasts across five application areas for AI throughout the battery lifecycle, including technology benchmarking and data-driven market predictions. Over 20 company profiles.
Collaborative robots (cobots), mobile manipulators, end-effectors, sensors, grippers, automotive manufacturing, picking and placing, palletizing, packaging, food and beverage, electronics, EV Li-ion battery
Autonomous consumer cars by SAE level (L0, L1, L2, L2+, L3, L4), Level 4 driverless robotaxis, commercial robotaxi services, autonomous driving rules & regulations, where autonomous vehicles are allowed on the road, enabling technologies.
2.5D, 3D, advanced semiconductor packaging, RDL, dielectric material, Cu-Cu hybrid bonding, EMC, MUF, interposer, glass, processes, FOWLP, FOPLP, die stacking, organic, inorganic
Heterogeneous Integration, AI, HPC, Data Centers, Semiconductor Packaging Market Forecast, Antenna in Package, 2.5D, 3D, Fan-Out, FOWLP, FOPLP, Through-Si-Via, Glass Packaging, Co-Packaged Optics, RDL (Redistribution Layer), Hybrid Bonding
Modular architecture, supply chain resilience, heterogeneous integration, advanced packaging, advanced interconnects and communications, thermal management solutions
Key applications of helium in semiconductor manufacturing, leak testing (e.g. EV batteries), cryogenics (MRI, NMR, quantum computing), and aerospace, with trends in adoption of substitutes, reclamation technologies, and 10-year forecasts
Heavy-duty autonomous trucks - US, EU, and Chinese truck market, key players, trends, safety, regulations, industry analysis, autonomous truck sensors, Mobility as a Service (MaaS), enabling technologies, and market forecasts.
Comprehensive overview of the technologies, applications, trends, and opportunities in the quantum computing market, quantum sensing market, and quantum communications market as well as the overarching trends in quantum material development.
Market for 3D electronics, covering electronics on 3D surfaces, in-mold electronics, fully additive 3D electronics, metallization methods, additive electronics materials, and applications.
Granular ten-year TIM, die-attach and substrate-attach market forecasts for Si IGBT, SiC MOSFETs, and GaN. Liquid Cooling forecast for inverters and motors. Power module suppliers' profile and supply chain analysis.
TOF or FMCW detection; mechanical, MEMS, OPA, flash, liquid crystal and other solid-state lidar for ADAS, autonomous vehicles, industrial, smart city, security and mapping with automotive focus
AiP, Antenna, Advanced Semiconductor Packaging, Substrate technology, 5G, 6G, Phased array, fan-out, flip-chip, glass, LTCC, HDI, EMI, Beamforming