Printed, Flexible and Organic Electronics

Printed, Flexible and Organic Electronics

Printed Electronics, being thin film silicon or inorganic or organic semiconductors, can be used to form Thin Film Transistor Circuits (TFTCs), such as replacing the functionality of simple silicon chips. TFTCs also employ thin film conductors and dielectrics and the ultimate objective is to make many different components at the same time - such as displays, batteries, sensors, microphones etc using the same materials or at least the same deposition techniques thus saving cost and improving reliability. Some TFTCs will be capable of covering large areas to affordably form electronic billboards, smart shelves and so on. They will be lightweight, rugged and mechanically flexible. Often they will be made by rapid, high-volume reel-to-reel processing even forming a part of regular printing processes for graphics. These circuits will be cheap enough to permit electronics where envisaged silicon chips are always or almost always too expensive, where multiple components and needed, and where silicon is impracticle (e.g. not flexible, brittle, thick etc).
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2013
27 Feb 2013

MEGTEC Systems

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25 Feb 2013

IDTechEx appoints new Senior Technology Analyst

IDTechEx have recently strengthened their research capabilities by appointing a new Senior Technology Analyst, Dr Wendy Kneissl.
21 Feb 2013

Graphene transistor with a new operating principle

In the developed transistor, two electrodes and two top gates are placed on graphene and graphene between the top gates is irradiated with a helium ion beam to introduce crystalline defects.
21 Feb 2013

MC10

MC10 were founded in 2010 in the Boston area to commercialize conformable and/or stretchable electronics. The company has its roots in Prof John Roger's lab at the University of Illinois. The company has so far raised approx. $60 million venture capital funding. Their first product is a wearable sensor sold under the Reebok brand.
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20 Feb 2013

Xolve, Inc

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20 Feb 2013

SukYoung Kim appointed General Manager of AIXTRON Korea

AIXTRON SE has announced that SukYoung Kim has been appointed General Manager of its subsidiary AIXTRON Korea Co., Ltd.
20 Feb 2013

Change in the Executive Board of AIXTRON SE

AIXTRON SE has announced that Paul Hyland, AIXTRON SE's President and CEO will leave the Company by mutual agreement with effect as of February 28, 2013, for personal reasons.
20 Feb 2013

On a roll: why E Ink is still the leader in e-paper

E-paper technologies are attempts to mimic paper, which can be described as a reflective surface, non-emissive and viewable from any angle.
19 Feb 2013

Cellergy

Cellergy is a developer of small supercapacitors for electronic applications. The company is currently under change of management given bad financial situation.
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19 Feb 2013

FUJIFILM

Fujifilm Dimatix has very high market penetration of inkjet printers and print heads for printed electronics. Its activity is profitable. However, inkjet printing has not been adopted so far for much commercial production of printed electronics, with other printing options being preferred but the company is also using its PZT technology in other applications.
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18 Feb 2013

Flisom raises funding to ramp up 15 MW flexible CIGS production plant

Flisom has raised a substantially large investment to further develop its technology and build a production plant with an annual capacity of 15MW in Switzerland.
15 Feb 2013

Sharp Technology Ventures (STV)

Sharp Laboratories of America is the US R&D center of Sharp Corporation. In its early years, Sharp Labs started providing fabrication services to some of their key partners. This activity evolved into contract research and the launch of a new entity: Sharp Technology Ventures (STV).
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14 Feb 2013

Outlook for smart packaging: $75 million to $1.45 billion in ten years

It has been a slow path to commercialize smart packaging. Despite strong needs such as the aging population, tougher legislation, huge waste, more demanding consumers and concerns about safety and crime; commercial success has been mixed.
13 Feb 2013

FLEX 2013

The FLEX 2013 conference and exhibition took place in Phoenix, Arizona between the 30th of January and the 1st of February 2013.
11 Feb 2013

Easy laboratory automation with Aerotech's Ensemble LAB

Aerotech's new Ensemble® LAB control platform makes it easier than ever to automate laboratory and light industrial manufacturing applications.
8 Feb 2013

New VacuTran™ breaks parts-per-million WVTR measurement barrier

The launch of VG Scienta's new VacuTran is a major game-changing event for the Plastic Electronics industry, enabling WVTR measurement of barrier layers to better than 10-6 g/m2/day and simultaneous O2 permeation to better than 10-3 cm3/m2/day.
7 Feb 2013

GSI Technologies LLC

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5 Feb 2013

Smartphone with LCD and e-paper display

Yota Devices has developed the first dual-screen phone with a full-color liquid crystal display on one side and an electronic paper display on the other.
4 Feb 2013

EU project to take flexible OLEDs from lab to fab

A newly launched, €11.2-million European project aims to help bring flexible OLEDs to market within six years.
31 Jan 2013

First roll to roll machine for printed electronics

CETEMMSA now has a Roll-to-Roll flat screen printer machine for printing electronics on flexible surfaces.