Printed, Flexible and Organic Electronics

Printed, Flexible and Organic Electronics

Printed Electronics, being thin film silicon or inorganic or organic semiconductors, can be used to form Thin Film Transistor Circuits (TFTCs), such as replacing the functionality of simple silicon chips. TFTCs also employ thin film conductors and dielectrics and the ultimate objective is to make many different components at the same time - such as displays, batteries, sensors, microphones etc using the same materials or at least the same deposition techniques thus saving cost and improving reliability. Some TFTCs will be capable of covering large areas to affordably form electronic billboards, smart shelves and so on. They will be lightweight, rugged and mechanically flexible. Often they will be made by rapid, high-volume reel-to-reel processing even forming a part of regular printing processes for graphics. These circuits will be cheap enough to permit electronics where envisaged silicon chips are always or almost always too expensive, where multiple components and needed, and where silicon is impracticle (e.g. not flexible, brittle, thick etc).
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Printed, Flexible and Organic Electronics
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2017
10 May 2017

Elastomer Stamp Microassembly Of Diverse Hybrid Devices

X-Celeprint, Germany
10 May 2017

How Printed Image Sensors Are Reshaping The Landscape Of The Biometrics Market

ISORG, France
10 May 2017

Biowatch: A Wearable Biometric Solution

Biowatch SA, Switzerland
10 May 2017

3D Printing: A New Dimension In Electronics Prototyping And Manufacturing

Nano Dimension, Israel
10 May 2017

Hybrid Integration Of Thin Silicon Devices On And In Flexible Film Substrates

Fraunhofer EMFT, Germany
10 May 2017

Fingerprint Sensing - Moving Beyond The Button

Synaptics, Inc.United States
10 May 2017

Smart Digital Interactions (Retail, Health, Hospitality) And Flexible Hybrid Electronics Integration Opportunities And Challenges

Jabil, United States
10 May 2017

Voice Biometrics Sensors

Vocalzoom, Israel
10 May 2017

Printed Electronics And Additive Microelectronic Packaging For RF/Microwave Applications

University of Massachusetts Lowell, United States
10 May 2017

Printed Conformable Sensory Surfaces

Holst Centre/TNO, Netherlands
10 May 2017

Manufacturing Technology Of All-Solid-State Thin-Film Lithium Secondary Battery For IoT Applications

ULVAC, Japan
10 May 2017

3D Printed Structural Electronics At TNO - AMSYSTEMS Center

TNO, Netherlands
10 May 2017

Complex Hydride-Based Solid-State Electrolytes

Empa, Switzerland
10 May 2017

Soft Condensed Mater Sensor Structures For Soft Body Dynamic And Vital Function Monitoring

Empa, Swiss Federal Lab for Materials Science, Switzerland
10 May 2017

Touch Interaction Taken To The Next Level

Tacterion GmbH, Germany
10 May 2017

Flexible Energy Storage: The Importance Of Thickness

Zinergy UK Ltd, United Kingdom
10 May 2017

Present Progress In Flexible Hybrid Electronics Technology

DoMicro BV, Netherlands
10 May 2017

Printing Of Electrode Materials For Innovative Solid State Lithium Ion Microbattery

Fraunhofer IFAM, Germany
10 May 2017

Fully Printed Sensors For Realizing Intelligent Surfaces

Joanneum Research, Austria
10 May 2017

Merging Form And Function With Injection Molded Structural Electronics

TactoTek, Finland