Portal


James Hayward
James Hayward
IDTechEx
+44(0)1223 810266
Email Engagement Manager

Upcoming webinars

Conductive Joining Technologies: The Race to Replace Lead-Based Solder

25 May 2021 by Thomas Lynch
This IDTechEx premium article investigates alternative die attach materials
Login or Register You are not logged in. Please login or register with idtechex.com for more details about premium content from IDTechEx.