20-year forecasts for materials opportunities in quantum computing, quantum sensing, and quantum communications. Technologies, key players, supply chain dynamics for superconductors, photonics, PICs, nanomaterials, and diamond for quantum applications.
Granular 10-year forecasts on BESS for data centers and C&I applications. Analyses on players, key projects, applications, battery storage technology trends & benchmarking, LFP Li-ion costs & manufacturing. Insights from dozens of primary interviews.
Global sensor market including future mobility, LiDAR, radar, cameras, IR; MEMS, wearables; AI, edge sensors; quantum sensors; printed sensors; gas sensors; battery sensors; silicon photonics, image sensors, with 10-year granular sensor market forecast
Low-loss materials for 5G, 6G, automotive radars, high-speed digital, with market assessment, player overview, trends, detailed benchmarks, and forecasts.
6G, sub-THz, NTNs, Reconfigurable Intelligent Surfaces (RIS), Distributed MIMO, Semiconductors for 6G, antenna packaging, low-loss materials, heterogeneous integration.
Material demand, benchmarking, market trends, TIM1/TIM1.5/TIM2, TIMs in 5G, EV batteries and power electronics, semiconductor packaging, space/satellite, data centers, ADAS, consumer electronics, TIM fillers, 10-year forecast by industry.
The complete analysis of the global RFID industry.
10-year granular forecast and market sizing, this report covers advancements in HBM, QLC SSDs, next-gen HDDs (HAMR, MAMR), and emerging memory (MRAM, RRAM, FeRAM, PCM) for AI, HPC, data centers, cloud, edge, IoT, and embedded applications.
Private ADAS Vehicles in SAE Level 2 to Level 3 Market, autonomous driving rules & regulations, ADAS Solution Providers, Soc Manufactures, Sensor Suite for ADAS Cars, enabling technologies.
Assessment of emerging PFAS alternatives in critical application areas: hydrogen economy, sealing, 5G, electric vehicles, sustainable packaging. Extensive analysis of current and proposed regulations limiting the use of forever chemicals.
Compound Semiconductors, Transceivers, Indium Phosphide/InP PICs, Thin-Film Lithium Niobate/TFLN PICs, PICs for Quantum, Light-based Interconnects, Manufacturing, Materials, Co-Packaged Optics
Autonomous consumer cars by SAE level (L0, L1, L2, L2+, L3, L4), Level 4 driverless robotaxis, commercial robotaxi services, autonomous driving rules & regulations, where autonomous vehicles are allowed on the road, enabling technologies.
Heterogeneous Integration, AI, HPC, Data Centers, Semiconductor Packaging Market Forecast, Antenna in Package, 2.5D, 3D, Fan-Out, FOWLP, FOPLP, Through-Si-Via, Glass Packaging, Co-Packaged Optics, RDL (Redistribution Layer), Hybrid Bonding
Key applications of helium in semiconductor manufacturing, leak testing (e.g. EV batteries), cryogenics (MRI, NMR, quantum computing), and aerospace, with trends in adoption of substitutes, reclamation technologies, and 10-year forecasts
Flake-based, nanoparticle, particle-free, copper, stretchable, thermoformable nanowire inks for photovoltaics, EMI shielding, printed electronics, flexible hybrid electronics, wearable electronics, e-textiles, 3D electronics
Covering Reconfigurable Intelligent Surfaces, radar beamforming, anti-reflection coatings, laser glare protection, metalenses and LiDAR beam-steering. Forecasts of revenue, surface area, and units 2024-2034
Market for 3D electronics, covering electronics on 3D surfaces, in-mold electronics, fully additive 3D electronics, metallization methods, additive electronics materials, and applications.
Granular ten-year TIM, die-attach and substrate-attach market forecasts for Si IGBT, SiC MOSFETs, and GaN. Liquid Cooling forecast for inverters and motors. Power module suppliers' profile and supply chain analysis.
Market for printed sensors including, organic photodetectors, wearable electrodes, force sensors and piezoresistive sensors, piezoelectric sensors, temperature sensors, gas sensors, capacitive touch sensors and stretchable strain sensors.
AiP, Antenna, Advanced Semiconductor Packaging, Substrate technology, 5G, 6G, Phased array, fan-out, flip-chip, glass, LTCC, HDI, EMI, Beamforming