Global sensor market including future mobility, LiDAR, radar, cameras, IR; MEMS, wearables; AI, edge sensors; quantum sensors; printed sensors; gas sensors; battery sensors; silicon photonics, image sensors, with 10-year granular sensor market forecast
Granular ten-year forecast for data center cooling technologies and components, including air cooling, single-phase/two-phase D2C/immersion cooling and their associated components. Comprehensive analysis of TIM2 for data center components.
Market for secondary source critical material extraction technology, critical material recovery technology, rare earth recycling, lithium-ion battery technology metal recovery, critical semiconductor recovery, platinum group metal recovery
SDVs, Connected and Autonomous Vehicles (CAVs), In-Car AI Assistants, V2X, Autonomy as a Service, Connected Vehicles, E/E Architecture, Intelligent Transportation Systems (ITS-G5), DSRC, C-V2X, Features as a Service, ADAS
Graphics processing units (GPUs), central processing units (CPUs), custom AI ASICs, and other AI accelerators, with player analysis, technologies, trends, supply chain, and forecasts
Compound Semiconductors, Transceivers, Indium Phosphide/InP PICs, Thin-Film Lithium Niobate/TFLN PICs, PICs for Quantum, Light-based Interconnects, Manufacturing, Materials, Co-Packaged Optics
Radars for autonomous cars & robotaxis, long-range radar, short-range radar, radar cocooning, 4D imaging radar, high-channel-count radars, semiconductor technologies for radar, waveguide antenna, automotive radar forecasts
High-Performance Computing, Exascale Supercomputers, AI Chips, CPUs, GPUs and Accelerators, Memory, Storage, Advanced Semiconductor Packaging, Networking, Interconnects and Thermal Management.
Comprehensive overview of the technologies, applications, trends, and opportunities in the quantum computing market, quantum sensing market, and quantum communications market as well as the overarching trends in quantum material development.
Market for 3D electronics, covering electronics on 3D surfaces, in-mold electronics, fully additive 3D electronics, metallization methods, additive electronics materials, and applications.
AiP, Antenna, Advanced Semiconductor Packaging, Substrate technology, 5G, 6G, Phased array, fan-out, flip-chip, glass, LTCC, HDI, EMI, Beamforming
Materials, methods and applications for electromagnetic interference (EMI) shielding including package-level shielding, sputtering, printing, conductive inks, MXenes, nanocarbons, heterogeneous integration, system-in-package, compartmentalization.
Semiconductor materials trends within electric and autonomous vehicles, battery management system (BMS), microcontrollers (MCU), Systems on chips (SoCs), ADAS, LiDAR, radar, 5G connectivity. Silicon (Si), Gallium Nitride (GaN), Silicon Carbide (SiC).